aoyue Int732, Instruction Manual

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12
OPERATING PROCEDURES
6. To view the actual temperature read by the three external temperature
sensor, repeatedly press the selection button until the top display shows the
top heater external temperature probe's ( probe A ) actual temperature
followed by a suffix “A” . The middle display will show external temperature
probe b ’s actual measured temperature followed by a suffix “b”. And the
bottom display would show the actual measured temperature of the external
temperature probe C . It is followed by a suffix “c”.
Note: Under type “1” mode of operation it is not necessary to monitor the
internal temperature sensor’s read out. i.e. internal temperature readouts
with suffix “d” and “E” .
External temperature probes are labeled. Top heater external
probe is labeled A, while the other two is labeled b and C. The displayed
actual temperature reading’s suffix corresponds to the labels.
F. TYPE “2” OPERATION
Before proceeding with this type of operation, attach the top external
temperature probe A to one corner of the BGA or IC to be reworked. Then attach
the external temperature probe b to the underside of the PCB to be worked on,
preferably to the side and not directly under the BGA or IC to be reworked on. The
external temperature probe C can be placed near any area of interest.
This type of operation utilizes the external temperature probe A to regulate the
top heater, while the external temperature probe b regulates the heat of the
bottom heater. The external temperature probe C can be used for additional
monitoring.
In profile mode the first 3 segments utilizes the bottom heater to reach 75% of
the required heat for reflow. After which the bottom heater would regulate the
board at the temperature set at segment 3. Then the last three segments utilizes
the top heater to provide the final 25% of the heat to reach reflow.
5
FUNCTIONS and FEATURES
●
Multi­Point Board Holder
— Innovative board holder: Nine securing screws with four side grips to
provide a secure fit for various board sizes and shapes. Effectively minimizes
BGA balls shorting together due to board warping.
●
Multi­Axis Armature
— Top heater’s support allows 3 degrees of freedom: Rotation of the Top
heater, Swiveling of the armature, and sliding adjustments. This new design
expands the effective working coverage of the unit, allowing us to access even
those ICs at the edge or corner of the PCBs.
●
Digital System Control and Safety
— CPU controlled system with easy to use digital controls and display. Uses
advanced digital controls and signal processing for maximum performance, and
accuracy. Built­in overheat protection and temperature limiting. The system
automatically limits the rise in temperature to industry standard 3 degrees per
second. This will minimize damage to sensitive components and ensure proper
reflow.
●
Profile mode with auto adjustment
— Three programmable 6 segment reworking profile. Set and store the desired
duration and temperature to ensure high success rate for repetitive reworks.
Equipped with auto profile adjustment, system auto edits your profile to ensure
profile meets industry standard limits.
●
The Integrated Solder Iron has excellent thermal recovery specifically designed
for the lead free soldering process. It has a wide range of tips sizes and styles
designed to fit different requirements. Select tunnel type when cleaning BGAs,
use the blade type for drag soldering, conical types for normal thru­hole
soldering and many more different tip size and styles.
●
Wide Compatibility
— The entire system is compatible with Lead free solder, is RoHS, CE and ESD
Safe compliant.