Installing the 1779KFM Interface
Chapter 4
42
To allow necessary air flow for cooling of components, refer to Figure 4.1
and follow these rules:
Do not mount an I/O chassis above a processor chassis.
Minimum vertical separation between chassis and to top and bottom of
the enclosure is six inches, with no chassis mounted above the 60
o
C air
temperature level (Figure 4.1).
Minimum horizontal separation between chassis and to enclosure sides
is 4 inches.
Leave any excess space at the top of the enclosure where the
temperature is the highest.
Wiring ducts, taps, and terminal strips should be mounted no closer
than 2 inches from any chassis.
Figure 4.1
Minimum Spacing for Necessary Air Flow for Cooling
GY
4
6
4
4
4
6
6
6
1