Advantech MIC-3397, User Manual

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MIC-3397 User Manual 4
1.2.3 BIOS
Dual 8M-Byte SPI flash contains a board-specific BIOS (from AMI) designed to meet
industrial and embedded system requirements.
1.2.4 Chipset
The Intel
®
Mobile PCH DH8900 chipset provides excellent flexibility for developers of
embedded applications by offering up to 5 GT/s for fast access to peripheral devices.
It delivers outstanding system performance through high bandwidth interfaces such
as PCI Express, Serial ATA and USB 2.0.
1.2.5 Memory
The MIC-3397 has up to 8 GB of onboard DDR3 memory and one 204-pin unbuf-
fered DDR3 SO-DIMM sockets up to 8GB memory with ECC support. The following
table shows a list of SO-DIMM modules that have been tested on the MIC-3397.
1.2.6 Ethernet
The MIC-3397 uses one Intel
®
I210AT GbE Controller to provide 10/100/1000 Mbps
Ethernet connectivity (LAN1) and four Marvell 88E1112 LAN PHY chips with inte-
grated LAN MAC in PCH DH8900 to provide 10/100/1000 Mbps Ethernet connectiv-
ity (LAN2 ~ LAN5) via rear I/O. Optional settings for the source of each individual
Brand Size Speed Vendor PN ECC Memory Chip
ATP 4GB DDR3-1600 AW12M7228BKK0S Yes
Samsung 256Mx8
DDR3 2-ranks
Memphis 4GB DDR3-1600 D3SO512M726G-A28MTK Yes
Memphis 256Mx8
DDR3 2-ranks
Hynix 4GB DDR3-1600 D3XH56082XH12AA Yes
Hynix 256Mx8 DDR3
2-ranks
Memphis
8GB
(Extended
temperature)
DDR3-1600 D3SO1G726GI-A58MA Yes
Memphis 512Mx8
DDR3 2-ranks
Memphis 8GB DDR3-1600 D3SO1G726G-A58MA Yes
Memphis 512Mx8
DDR3 2-ranks
ATP 8GB DDR3-1600 AW24M7228BLK0S Yes
Samsung 512Mx8 2-
ranks
Transcend 8GB DDR3-1600 TS1GSK72V6H Yes
Samsung 512Mx8 2-
ranks
Note! If you don't have above SO-DIMM module on hand, please make sure
your module is compatible with what Intel validated configurations as
below.
Unbuffered/ECC Supported SO-DIMM Module Configurations
DIMM
Capacity DRAM Device
Technology DRAM
Organization # of DRAM
Devices # of Physical
Device Ranks # of Banks Inside
DRAM Page
Size
4GB 2GB 256 M X 8 18 2 8 8 K
8GB 4GB 512 M X 8 18 2 8 8 K