14
Functional Description
Leading
EDGE COMPUTING
Supported Technologies
Z
Intel® Virtualization Technology for Directed I/O (Intel®
VT-d)
X
Intel® Virtualization Technology (Intel® VT-x)
X
Intel® vPro Technology (Intel® VT)
X
Intel® Trusted Execution Technology (Intel® TXT)
X
Intel® Hyper-Threading Technology
X
Intel® 64 Architecture
X
Intel® Turbo Boost Technology 2.0
X
AES New Instructions
X
Intel® My WiFi Technology
X
Enhanced Intel SpeedStep® Technology
X
Thermal Monitoring Technologies
X
Intel® Fast Memory Access
X
Execute Disable Bit
X
Intel® VT-x with Extended Page Tables (EPT)
Interfaces
X
Dual channel DDR3 memory with one channel of unbuffered
SODIMM and one channel of soldered SDRAM
X
Memory DDR3 data transfer rates of 1333 MT/s and 1600
MT/s
X
64-bit wide channels plus 8-bits of ECC support for each
channel
X
System Memory Interface I/O Voltage of 1.35V and 1.5V
X
1-Gb, 2-Gb, and 4-Gb DDR3 DRAM technologies supported
Z
Using 4Gb DRAM device technologies, the largest mem-
ory capacity possible is 8 GB.
Z
Intel Fast Memory Access:
Just-in-Time Command Scheduling
Command Overlap
Out-of Order Scheduling
X
The PCI Express lanes are fully-compliant with the PCI
Express Base Specification, Revision 3.0, including support
for 8.0 GT/s transfer speeds.
Summary of Contents for VPX3000 Series
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