AXM-VFX-EDK User’s Manual Mezzanine Board
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Acromag, Inc. Tel:248-295-0310 Fax:248-624-9234 Email:[email protected] http://www.acromag.com
18
Single AXM-VFX-EDK Board
Stacking Height
5.0 mm (0.197 in)
Depth
99.0 mm (3.9 in)
Width
74.0 mm (2.913 in)
Board Thickness 1.62 mm (0.064 in)
AXM-VFX-EDK:
1.44oz (0.0408Kg)
•
AXM-VFX-EDK Front Field I/O:
14-pin, 2mm double row male header
(standard Xilinx JTAG header). 34-pin, 0.1” double row header.
Power Requirements
TYP
1
MAX
2
3.3V (
±
5%)
1
VFX-EDK 30mA
70mA
5V (
±
5%)
1
VFX-EDK
Not
Used
1. Power source is the base board. Current draw is for AXM module
only.
2. Floating or shorted I/O will have higher current draw.
Operating Temperature:
0
°
C to +70
°
C
Relative Humidity:
5-95% Non-Condensing.
Storage Temperature:
-55
°
C to 150
°
C.
Non-Isolated:
Logic and field commons have a direct electrical connection.
Radiated Field Immunity (RFI):
Complies with EN61000-4-3 (3V/m, 80 to
1000MHz AM & 900MHz. keyed) and European Norm EN50082-1 with no
register upsets.
Conducted R F Immunity (CRFI):
Complies with EN61000-4-6 (3V/rms,
150KHz to 80MHz) and European Norm EN50082-1 with no register
upsets.
Electromagnetic Interference Immunity (EMI):
No register upsets occur
under the influence of EMI from switching solenoids, commutator motors,
and drill motors.
Surge Immunity:
Not required for signal I/O per European Norm EN50082-1.
Electric Fast Transient (EFT) Immunity:
Complies with EN61000-4-4
Level 2 (0.5KV at field I/O terminals) and European Norm EN50082-1.
Electrostatic Discharge (ESD) Immunity:
Complies with EN61000-4-2
Level 3 (8KV enclosure port air discharge) Level 2 (4KV enclosure port
contact discharge) Level 1 (2KV I/O terminals contact discharge) and
European Norm EN50082-1.
6.0
SPECIFICATIONS
PHYSICAL
Unit Weight (Including all
mounting hardware)
Connectors
Table 6.1: Power
Requirements for Example
Design
ENVIRONMENTAL