20
3dscentral.3dsystems.com
7.3 Post-Processing Using the Dipping
Method
Most parts can be infiltrated simply by dipping briefly in the Z-
Bond, then allowing the part to dry.
Be sure the part is dry
and completely free of loose powder before infiltrating
.
1.Place the wax paper
near the container and
pour enough Z-Bond into
the container to com-
pletely submerge the
part.
2.Gently submerge your
part into the liquid.
•
Look for bubbles rising. If you don’t see any, let the part
sit submerged for about 10 seconds and then remove it
from the liquid.
•
If you see bubbles rising, wait until the bubbles stop
and then remove the part.
3.
Keep the part moving in your hands so it does not stick to
your gloves.
Note:
The part will get very warm and may emit visible
vapor. These are normal by-products of the curing process.
4.
Quickly and thoroughly wipe any excess liquid off the part
with paper towels and place the part on the wax paper.
•
Do not let excess liquid pool on the part as this may
cause its texture to change.
•
Move the part frequently for the first few minutes. This
prevents pooling of Z-Bond under the part and the part
adhering to the paper.
5.
Let the part dry and cool at least 30 minutes before han-
dling.
6.
Return any unused Z-Bond to its bottle for reuse.
QSG-23
