39
HE4K-DCK-1x & FV4K-DCK-1x
HARDWARE SPECIFICATION
CONFIDENTIAL
DOC-USR-0100-09
____________________________________________________________________________________
Z3 Technology, LLC
♦
100 N. 8th St. STE 250
♦
Lincoln, NE 68508-1369 USA
♦
+1.402.323.0702
11)
Attach “Thermal Pad 2-1” and “Thermal Pad 2-2” onto the at Interface Front End PCB as shown below.
Figure 21
Attach “Thermal Pad 2
-
1” and “Thermal Pad 2
-
2”
12)
Apply thermal paste to the bottom of the aluminum heat sink.
Figure 22 Apply Thermal Paste to the Aluminum Heat Sink