2
HE4K-DCK-1x & FV4K-DCK-1x
HARDWARE SPECIFICATION
CONFIDENTIAL
DOC-USR-0100-09
____________________________________________________________________________________
Z3 Technology, LLC
♦
100 N. 8th St. STE 250
♦
Lincoln, NE 68508-1369 USA
♦
+1.402.323.0702
REVISION HISTORY
Version Date
Change Note
Author
1.00.00
07/20/2016
Original Document
BM
1.00.01
02/03/2017
Correction to Section 6.0 Specifications. Updates to Section 5.0
Camera Connections. Addition of Appendix 1: Example of Proper
Thermal Dissipation.
TA
1.00.02
02/22/2017
Correction to Section 2.0 Features.
TA
1.01.00
09/11/2017
Add FV4K-DCK-1X
BM
1.01.01
1/29/2018
Changed -10 to -1X
SI
1.01.02
09/12/2018
Added and updated info about differences between CPU v1 and v2, &
FV4K-DCK-15 pinout connectors. Updated Temperature Spec
BM & SI
1.01.02
09/14/2018
Removed references to CMOS
SI
1.01.02
04/26/2019
Updated FV4K-DCK-15 to EIB-UAV-01. Added EIB-UAV-01 Bill of
Materials. Added EIB-UAV-01 Block Diagram
SI
1.02.03
02/03/2021
Updated Figure 1 and Figure 11 with 30-0091-12. Added tables 21 and
22.
SI