LPM2100 mg NB Module Hardware User Guide
Shanghai Yuge Information Technology Co., Ltd.
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Chapter 7. Production and packaging
7.1 Chapter overview
Module packaging and storage
Production welding
7.2 Module packaging and storage
The LPM2100 mg series modules are packaged in trays and packaged in vacuum-sealed
bags, with a 10PCS package and a 100PCS package, shipped as a vacuum sealed bag.
The storage of the LPM2100 mg series module module is subject to the following
conditions:
The module has a moisture sensitivity rating of 3 levels.
When the ambient temperature is greater than 40 degrees Celsius and the air
humidity is less than 90%, the module can be stored in a vacuum sealed bag for 12 months.
When the vacuum sealed bag is opened, if the ambient temperature of the module is
lower than 30 degrees Celsius and the air humidity is less than 60%, the factory can complete
the patch within 72 hours, and the module can directly perform reflow soldering or other high
temperature process.
If the module is in other conditions, it needs to be baked before the patch.
If the module needs to be baked, please remove the module and bake it for 8 hours at
125 degrees Celsius (allowing fluctuations of up to 5 degrees Celsius).
7.3 Production welding
The LPM2100 mg series modules are packaged in anti-static trays. The SMT line needs
to be equipped with a Tray module. It is recommended to use a reflow oven above 7
temperature zones
；
To ensure the quality of the module paste, the thickness of the stencil corresponding
to the pad portion of the LPM2100 mg series module is recommended to be 0.18mm.
The recommended reflow temperature is 235~245oC, which cannot exceed 260oC.
When the PCB is laid out on both sides, the LCC module layout must be machined
on the 2nd side. Avoid module falling parts, welding and welding, and poor internal welding
of the module caused by the gravity of the module.
The recommended furnace temperature curve is shown below
：
