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LPM2100 mg NB Module Hardware User Guide

Shanghai Yuge Information Technology Co., Ltd.

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3.13 Other interface......................................................................................................- 28 -

3.13.1 WAKEUP interface....................................................................................- 28 -
3.13.2 WAKEUP_OUT interface*....................................................................... - 29 -

Chapter 4. Overall RF technical indicators.......................................................................... - 30 -

4.1 Chapter overview....................................................................................................- 30 -
4.2 Main antenna and Bluetooth antenna..................................................................... - 30 -
4.3 RF signal line routing guide................................................................................... - 32 -
4.4 RF connector.......................................................................................................... - 33 -
4.5 Working frequency................................................................................................. - 34 -
4.6 Conducted transmit power and receive sensitivity.................................................- 34 -
4.7 RF power consumption characteristics...................................................................- 35 -

Chapter 5. Interface electrical characteristics.......................................................................- 36 -

5.1 Chapter overview....................................................................................................- 36 -
5.2 Range of working temperature............................................................................... - 36 -
5.3 Module IO level......................................................................................................- 36 -
5.4 Power supply.......................................................................................................... - 36 -
5.5 Electrostatic property..............................................................................................- 37 -
5.6 Reliability index..................................................................................................... - 37 -

Chapter 6. Structural and mechanical properties..................................................................- 39 -

6.1 Chapter overview....................................................................................................- 39 -
6.2 Exterior...................................................................................................................- 39 -

Chapter 7. Production and packaging...................................................................................- 41 -

7.1 Chapter overview....................................................................................................- 41 -
7.2 Module packaging and storage...............................................................................- 41 -
7.3 Production welding.................................................................................................- 41 -

Chapter 8. Abbreviation........................................................................................................- 43 -

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Содержание LPM2100 mg

Страница 1: ...PM2100 mg NB Module Hardware User Guide Number of pages 44 Hardware design version V1 0 Document version V1 5 Date 2019 11 7 LPM2100 mg NB Module Hardware User Guide V1 5 Shanghai Yuge Information Tec...

Страница 2: ...19 5 17 John zhang Modify some information about hardware V1 1 interface changes V1 2 2019 6 22 John zhang 1 Unified limit operating temperature 2 Modify information related to IO voltage domain V1 3...

Страница 3: ...distribution map 11 3 2 2 Module pin description 12 3 3 Power interface 15 3 3 1 VBAT interface 15 3 3 2 VDD_EXT Voltage output 16 3 4 Switching machine reset mode 16 3 4 1 Boot 16 3 4 2 Shut down 17...

Страница 4: ...ncy 34 4 6 Conducted transmit power and receive sensitivity 34 4 7 RF power consumption characteristics 35 Chapter 5 Interface electrical characteristics 36 5 1 Chapter overview 36 5 2 Range of workin...

Страница 5: ...3 16 SIM circuit design 24 Figure 3 17 SIM card hot swap detection circuit 25 Figure 3 18 SPI read timing diagram 26 Figure 3 19 SPI write timing diagram 26 Figure 3 20 I2C interface reference circuit...

Страница 6: ...PI Signal Definition 26 Table 3 11 I2C pin definition 27 Table 3 12 Network indicator pin definition 27 Table 3 13 Network indication status 27 Table 3 14 General GPIO Pin Definitions 28 Table 4 1 RF...

Страница 7: ...NB module of the wireless solution product It is intended to describe the hardware components and functional characteristics of the module solution application interface definition and usage instruct...

Страница 8: ...d NB IoT series module that complies with 3GPP Release 13 With a total of 44 pins and an ultra small size of 15 8mm 17 7mm 2 2mm the modules meet almost all M2M requirements This series of modules is...

Страница 9: ...sor 192MHz MIPS processor with 16KB I Cache and 16KB D Cache Operating Voltage Low voltage 2 45V 4 21V Typical voltage 3 6V Standard voltage 3 1V 4 2V Typical voltage 3 7V Power saving PSM mode power...

Страница 10: ...n antenna 50 ohm interface Bluetooth antenna 50 ohm interface reserved Firmware upgrade Serial port upgrade Temperature range Normal operating temperature 20 C to 75 C Extreme operating temperature 40...

Страница 11: ...odule RF circuit and cannot interact with the network Sleep The module turns off most of the functions and will be synchronized with the network Idle Power on and successfully register the network in...

Страница 12: ...otal of 44 pins and include the following partial unit interface functions The functions of each unit interface will be described in detail in later chapters Power interface USIM interface UART interf...

Страница 13: ...s module defines that the NC pin is floating and must not be used The module WAKEUP PSM_EINT pin voltage domain is 1 1V 3 2 2 Module pin description The module interface pin definition is described be...

Страница 14: ...ive low SIM interface 2 SIM_DECT DI SIM card hot plug detection Internal level has been pulled up 10 SIM_GND SIM card ground GND 11 SIM_DATA IO SIM card bus data Internal 10K pull up resistor 12 SIM_R...

Страница 15: ...ll up 33 SDA IO I2C bus data input and output Internal 10K resistor pull up SPI interface 3 SPI_MISO DI Host input slave output IO voltage domain 4 SPI_MOSI DO Host output slave input IO voltage domai...

Страница 16: ...e The LPM2100 mg series module power connector consists of two parts VBAT is the working power of the module VDD_EXT is the internal LDO output IO voltage domain current load up to 50mA for external u...

Страница 17: ...in will output the IO voltage domain and the current load can be up to 50mA The external master can read the voltage of VDD_EXT to judge whether the module is powered on VDD_EXT can also be used as an...

Страница 18: ...ugh a mechanical push button switch A TVS tube is placed near the button for ESD protection The reference circuit diagram is as follows Figure 3 6 Mechanical button boot 3 4 2 Shut down The LPM2100 mg...

Страница 19: ...RESET reset pin The application detects that the module is abnormal When the software does not respond the module can be reset Pull the pin low for 100 450ms to reset the module The RESET pin is sensi...

Страница 20: ...Data Communication Equipment device The main serial port can realize AT interactive instructions and peripheral data interaction Debug the serial port to upgrade the firmware view log information and...

Страница 21: ...ltage domain Table 3 6 Serial port logic levels Parameter Minimum Maximum Unit VIL 0 0 3 VDD_EXT V VIH 0 7 VDD_EXT VDD_EXT V VOL 0 0 3 VDD_EXT V VOH 0 7 VDD_EXT VDD_EXT V 3 5 1Serial application circu...

Страница 22: ...ption mode 3 6 1 PSM The main purpose of the PSM function is to reduce module power consumption and extend battery life The module consumes a maximum of 5uA in PSM mode Suitable for services that have...

Страница 23: ...to be reachable at any time with a small delay The module will detect whether there is a downlink service arrival which is suitable for services with high latency requirements Module equipment genera...

Страница 24: ...IM_DECT DI SIM card hot plug detection Internal level has been pulled up 10 SIM_GND SIM card ground GND 11 SIM_DATA IO SIM card bus data Internal 10K pull up resistor 12 SIM_RST DO SIM card reset outp...

Страница 25: ...ly pulled up to VDD_EXT with a 100K resistor and no external pull up is required SIM_DECT is the SIM card inserted or not inserted detection pin the default is high level the SIM card status can be de...

Страница 26: ...normally open SIM card holder the detection level can be set by the AT command If AT HOSCFG 1 1 is set the state of the SIM card is high when it is in position When AT HOSCFG 1 0 is set the state of t...

Страница 27: ...ries module provides a set of SPI interfaces with an interface voltage of IO output level Table 3 10 SPI Signal Definition Pin Pin name IO Functional description Remarks 3 SPI_MISO DI Host input slave...

Страница 28: ...as shown below Figure 3 20 I2C interface reference circuit The I2C_SCL and I2C_SDA pins are internally pulled up so the external pull up resistor can be ignored during use 3 11 Network indication int...

Страница 29: ...pose GPIO interface The LPM2100 mg series modules offer two GPIOs Some of these GPIOs can be reused for multiple functions Consult the module provider for specific usage Table 3 14 General GPIO Pin De...

Страница 30: ...gure 3 22 WAKEUP wake up module reference circuit 3 13 2 WAKEUP_OUT interface The LPM2100 mg series modules support the WAKEUP_OUT function When the module is in the sleep state if a wake up event is...

Страница 31: ...t design the trace between the module and the antenna must be guaranteed to 50 ohms The antenna is a sensitive device that is susceptible to the external environment For example module size antenna po...

Страница 32: ...tenna matching circuit diagram LPM2100 mg series module two antennas are extracted by pad method The antenna impedance trace needs to be away from the digital signal line power supply and other interf...

Страница 33: ...the material the trace width W the ground clearance S and the height of the reference ground plane H Please use the impedance simulation tool to calculate the impedance value of the RF trace The contr...

Страница 34: ...nnector must use a 50 ohm characteristic impedance coaxial connector Hirose s UF L R SMT connector is recommended Figure 4 6 RF connector size chart The RF connector plug for this connector is HRS s U...

Страница 35: ...49 MHz 869 MHz 894 MHz B8 880 MHz 915 MHz 925 MHz 960 MHz B20 832 MHz 862 MHz 791 MHz 821 MHz B28 703 MHz 748 MHz 758 MHz 803 MHz 4 6 Conducted transmit power and receive sensitivity Table 4 4 Conduct...

Страница 36: ...echnology Co Ltd 35 4 7 RF power consumption characteristics Table 4 6 Power consumption Types Power MAX Call Current mA Power Avg Current B1 22 1 Max power 151 B3 22 3 Max power 140 B5 23 Max power 1...

Страница 37: ...Module IO level The LPM2100 mg series module port IO levels are as follows Which corresponds to 1 8V SIM application SIM_VDD is 1 8V corresponding to 3V SIM application SIM_VDD is 3V Table 5 2 Electr...

Страница 38: ...S The protective device PCB layout should be as close as possible to the V shaped line to avoid the T shaped line The ground plane around the module guarantees integrity and should not be split ESD co...

Страница 39: ...mperature 20 Working mode normal work Test duration 30 Cycles 1 h 1h cycle JESD22 A 105 B Visual inspection normal Function check normal RF indicator check normal Drop test Height 0 8 m 6 sides each t...

Страница 40: ...cal properties 6 1 Chapter overview Exterior Module mechanical size 6 2 Exterior The LPM2100 mg series module is a PCBA with a single sided layout The appearance of the module is as follows Figure 6 1...

Страница 41: ...LPM2100 mg NB Module Hardware User Guide Shanghai Yuge Information Technology Co Ltd 40 Figure 6 3 Bottom view of the LPM2100 mg series module unit MM...

Страница 42: ...lete the patch within 72 hours and the module can directly perform reflow soldering or other high temperature process If the module is in other conditions it needs to be baked before the patch If the...

Страница 43: ...7 1 Reflow soldering temperature graph Table 7 1 Reflow process parameter table Warm zone Time key parameter Preheating zone 40 165 Heating rate 1 s 3 s Temperature zone 160 210 t1 t2 70s 120s Recircu...

Страница 44: ...ate CTS Clear to Send DTR Data Terminal Ready DL Down Link DTE Data Terminal Equipment EMC Electromagnetic Compatibility ESD Electrostatic Discharge LED Light Emitting Diode NC Not Connected PCB Print...

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