10.
60/40 liquefies at 260 C.
This is the ideal soldering state, which allows the
solder to flow to the component and copper substrate layer. This state leaves a
smooth, shiny connection.
11.
60/40 flux vaporizes at about 370 C
. This is also to be avoided as it will leave a
dull looking and uneven connection.
12.
Use a hot iron.
In order to solder surface-mounted boards such as this, we need
a hot iron,
where the temperature is below 370 C
. We want to make sure that
there is enough heat to heat an area within the large copper tracks, or ground
plane, while also liquefying the solder rapidly. We do not want to apply heat to the
component lead for more than 3 seconds. So, we do want to heat up the copper
track and component lead rapidly and then apply the solder to the point in the
track where we want the joint.
13.
A temperature setting between 260 C and 350 C
is optimal assuming that you
are using either a chisel (2) or a bevel (3) bit.
This picture shows 1 Conical (pencil) bit, 2 Chisel bit, 3 Bevel bit
ASSEMBLY INSTRUCTIONS
RFLEGO Active Antenna Receiving Loop
page 18 of 66
