SERVICE MANUAL
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CONTENTS
SPECIFICATIONS ..................................................................... 3
PANEL LAYOUT ....................................................................... 4
DISASSEMBLY PROCEDURE ................................................. 5
LSI PIN DESCRIPTION ........................................................... 15
IC BLOCK DIAGRAM ............................................................. 17
CIRCUIT BOARDS .................................................................. 18
TEST PROGRAM ................................................................... 27
BACKING UP DATA AND INITIALIZING THE SETTINGS .... 32
TRANSMITTING SONG DATA BETWEEN THE COMPUTER
AND YDP-323 ....................................................................... 33
MIDI IMPLEMENTATION CHART .......................................... 34
MIDI DATA FORMAT ............................................................. 35
PARTS LIST
BLOCK DIAGRAM
CIRCUIT BOARD LAYOUT & WIRING
OVERALL CIRCUIT DIAGRAM
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’05.10
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001744