YDP-162B/YDP-162C/YDP-162R/YDP-162PE
14
15. HP Circuit Board
(Time required: About 2 minutes)
15-1
Remove the HP JACK assembly. (See procedure 14)
15-2
Remove the two (2) nuts marked [3B]. The HP circuit
board can then be removed from the H. P plate.
(Fig.
10)
16. Back
Top
Rail
Assembly
(Time required: About 2 minutes)
16-1
Remove the top board assembly. (See procedure 1)
16-2
Remove the four (4) screws marked [S01] and four (4)
screws marked [S02A]. The back top rail assembly can
then be removed. (Fig. 12)
17. Front
Rail
Assembly
(Time required: About 9 minutes)
17-1
Remove the top board assembly. (See procedure 1)
17-2
Remove the key cover assembly. (See procedure 6)
17-3
Remove the rack L and R. (See procedure 7)
17-4
Remove the stopper rail assembly. (See procedure 8)
17-5
Remove the key block assembly L and R.
(See procedure 9)
17-6
Remove the keyboard assembly. (See procedure 10)
17-7
Remove the two (2) screws marked [S13] each from
both sides of the assembly. (Fig. 11)
17-8
Remove the nine (9) screws marked [S15]. The front
rail assembly can then be removed. (Fig. 12)
HP
H.P PLATE
(H.P取付金具)
[3B]
●
HP JACK ASSEMBLY
(HP JACK Ass'y)
Fig. 10
(図10)
[S13]
FRONT RAIL ASSEMBLY
(
口棒 Ass'y)
SIDE ARM ASSEMBLY L
(
腕木 Ass'y
(
L))
<Side view
(側面)
>
Fig. 11
(図11)
15. HP シート
(所要時間:約 2 分)
15-1 HP JACK Ass'y を外します。(14 項参照)
15-2 [3B] のナット 2 個を外して、H.P 取付金具から HP
シートを外します。(図 10)
16. 背面框 Ass'y
(所要時間:約 2 分)
16-1 屋根 Ass'y を外します。(1 項参照)
16-2 [S01] のネジ 4 本と [S02A] のネジ 4 本を外して、
背面框 Ass'y を外します。(図 12)
17. 口棒 Ass'y
(所要時間:約 9 分)
17-1 屋根 Ass'y を外します。(1 項参照)
17-2 スライド蓋 Ass'y を外します。(6 項参照)
17-3 ラック(L・R)を外します。(7 項参照)
17-4 鍵盤押さえ Ass'y を外します。(8 項参照)
17-5 拍子木 Ass'y(L・R)を外します。(9 項参照)
17-6 GHD LKS 鍵盤を外します。(10 項参照)
17-7 [S13] のネジを左右 2 本ずつ外します。(図 11)
17-8 [S15] のネジ 9 本を外して、口棒 Ass'y を外します。
(図 12)
Содержание ARIUS YDP-162B
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