XJ128 and XJ128 Plus Printhead
XJ128 Guide to Operation
Xaar Document no: D031010302 Version A
Page 64
CE Compliance and working environment
Resistance to electrostatic discharge (ESD) reveals no damage or critical errors. Testing was
performed using a Keytek
™
200 ESD
-gun. The discharge level was set according to IEC 801-2 (EN
55024-2). The level of discharges was set to the specification limits of 8 kV for air discharge and 4 kV
for contact discharge. All interrupts caused by the discharge were reset without causing any
‘
hard
‘
failures to the printhead electronics. The level of function errors that could be reset was
approximately 300V. This means that the installation should protect the head from direct access if a
higher requirement is deemed as necessary. It also requires careful design of the media transport
mechanism and head mounting to avoid discharges into the printhead.
During installation of the print head in the application the head must be protected from electrostatic
discharges on the connector. The head can be compared with a normal CMOS circuit and must be
ESD protected accordingly to avoid later problem caused by discharges. The chip internal protection
level is 2 kV.
This product has been designed in accordance with the related EMC (Electromagnetic compatibility),
low voltage and safety standards.
This product was designed to fulfil the EMC requirements specified for
“
light industrial environments
”
.
Xaar cannot approve the product to be used in other classifications of environment, e.g.
“
medical
”
or
“
industrial
”
.
Any consequences resulting from the use of this equipment in unapproved environments are not the
responsibility of Xaar. Xaar recommends that the compatibility of this equipment should be suitably
tested in each non-approved environment before use.
For general safety reasons the use of this product in potentially explosive atmospheres must be
avoided.