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MDC901-EVBHB Rev2021Jan5 

MinDCet NV  

www.mindcet.com 

  

Attention: Please refer to Evaluation Kit Important Notice on page 20 

Page 21 

health it must be ensured by most advanced technological aid of suitable design of the customer application that no 
injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. 
 
3. Best Care and Attention 
Any product-specific notes, warnings and cautions must be strictly observed. 
 
4. Customer Support for Product Specifications 
Some products within the product range may contain substances which are subject to restrictions in certain jurisdictions 
in order to serve specific technical requirements. Necessary information is available on request. In this case the field 
sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter. 
 
5. Product R&D 
Due to constant product improvement product specifications may change from time to time. As a standard reporting 
procedure of the Product Change Notification (PCN) according to the JEDEC-Standard we inform about minor and major 
changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge 
should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected. 
 
6. Product Life Cycle 
Due to technical progress and economical evaluation we also reserve the right to discontinue production and delivery 
of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-
Standard  we  will  inform  at  an  early  stage  about  inevitable  product  discontinuance.  According  to  this  we  cannot 
guarantee that all products within our product range will always be available. Therefore it needs to be verified with the 
field sales engineer or the internal sales person in charge about the current product availability expectancy before or 
when the product for application design-in disposal is considered. The approach named above does not apply in the 
case of individual agreements deviating from the foregoing for customer-specific products. 
 
7. Property Rights 
All the rights for contractual products produced by MinDCet NV on the basis of ideas, development contracts as well as 
models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain 
with MinDCet NV. MinDCet NV does not warrant or represent that any license, either expressed or implied, is granted 
under any patent  right, copyright, mask work right, or other intellectual  property right  relating to any combination, 
application, or process in which MinDCet NV components or services are used. 
 
8. General Terms and Conditions 
Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and 
Conditions of MinDCet NV”, last version available at www.mindcet.com. 

 
 

Contact Information 

 
For product questions and technical assistance, please contact 

[email protected]

 

 

MinDCet NV 
Researchpark Haasrode 1716 
Romeinse Straat 10 
3001 Leuven 
Belgium 
 
Phone:  

+32 16 40 95 28 

Email:     

[email protected]

 

Tech support: 

[email protected]

 

Web:     

https://www.mindcet.com

 

Содержание MDC901-EVKHB

Страница 1: ... 20 Page 1 MDC901 EVKHB Technical Manual MDC901 200V GaN Gate Driver Half Bridge Evaluation Board Integrated High Side and Low Side GaN Gate Driver For the current version of this Technical Manual and accompanying product documentation visit mindcet com Scan the QR code for a direct link to the latest MDC901 documentation ...

Страница 2: ... board once all capacitors are discharged CAUTION PCB Surfaces may become hot during operation Do not touch board during operation or for 10 minutes following proper power down of the board CAUTION This product contains parts that are ESD sensitive Follow proper ESD handling procedures when handling the evaluation board and do not apply excessive voltages to the power supplies the bus voltages sig...

Страница 3: ... 3 Table of Contents Introduction 4 Overview 5 Board Block Diagram 8 Board Handling Instructions Quick Start 9 Dead Time Control Conditions 11 Temperature Measurements 13 EVB Operation Conditions 14 Performance Evaluation 16 Storage Conditions 17 Appendix 18 Cautions and Warnings 19 Important Notice 20 Contact Information 21 ...

Страница 4: ...ques and board results Evaluation Kit Contents To enable direct MDC901 evaluation the evaluation kit contains the necessary hardware for out of the box testing capability The MDC901 EVKHB includes Quantity Component Description 1 MDC901 EVBHB Half bridge evaluation board 1 Heatsink fan assembly w thermal interface material Alpha Heatsink type FSR30 15M32 0T2S1ZL 1 Plexiglass protection cover 4 Ele...

Страница 5: ...n refer to the most recent datasheet at https www mindcet com asic products 100V E Mode GaN Transistors 2 GaN Systems GS61008P enhancement mode GaN HEMTs with a VDS rating of 100V are present on board as high and low side power switches in the half bridge The GS61008P has a size of 7 5 x 4 6 x 0 51mm and RDS ON of 8 mΩ The GaN HEMTs leverage GaN s properties for high power densities with high volt...

Страница 6: ...ap Four operating modes are available for MDC901 operation defined by MHS_sel and MLS_sel state described in the truth table in Table 1 Table 1 for mode description truth table 2 MHS_sel GND Digital PWM input controlling HS and LS driver functions See CAUTION Dead time must be monitored by an oscilloscope in manual dead time mode to avoid HS LS overlap Four operating modes are available for MDC901...

Страница 7: ...o calculate temperature according to Section Temperature Measurement 3 NTC_Out Board temperature at NTC placed just below MDC901 See NTC_In 4 UVLS Digital output undervoltage on the LS supplies both regulated as preregulated supply levels Will give a low output in case of undervoltage condition 5 UVHS Digital output undervoltage on the HS supplies both regulated as preregulated supply levels Will ...

Страница 8: ...on operating conditions for safe handling of the EVB can be found in EVB Operation Conditions Power Good indicators which are individually labelled LEDs signal the presence of power for the 5V supply to the IC the 12V fan supply and Vbus When the LED illuminates voltage is present on the corresponding supply Board Block Diagram The EVB layout has been simplified to a block diagram in Figure 3 to d...

Страница 9: ...ont side Figure 2 block 4 to power the fan on In the instance that tests are to be conducted under conditions both with and without the fan assembly it is highly recommended to first conduct all non fan assembly tests followed by higher power test with the fan assembly installed as the thermal interface material is difficult to remove Figure 4 Standard EVB setup with external supply connections in...

Страница 10: ...y completed see previous section 3 Verify the LED status a PG 5V ON b PG 12V ON c PG Vbus OFF 4 Setup the desired jumper combinations refer to Dead Time Control Conditions a Dead time automatic or manual b Switching mode buck boost synchronous asynchronous c Enable pin to 5V 5 Set the PWM signal to the desired frequency and duty cycle if not regulated in closed loop 6 Increase Vbus while monitorin...

Страница 11: ...e chip and board is a highly recommended safety feature The Vbus input voltage should never exceed 100V including ringing Helpful Information The converter exemplifies the best performance in the 100kHz to 1MHz switching frequency range A 0 or 100 duty cycle are non switching situations of conversion Perform tests first without the heat sink fan assembly heat sink as removal of the heat sink after...

Страница 12: ... VinHS sync boost PWM VinLS transparent VinLS VinHS MHS_sel 0 0 1 1 MLS_sel 0 1 0 1 Figure 6 Synchronous buck mode example with placed jumpers Figure 6 displays an example of the EVB configured for manual dead time in synchronous buck mode determined by the MHS_sel and MLS_sel state as well as the jumpers on disILD and DTselect according to Table 1 TgapOn is the time between the LS falling and HS ...

Страница 13: ...11 8ns and TgapOff 11 8ns Temperature Measurements In addition to the on board temperature sensor of the MDC901 IC the evaluation board offers a second temperature measurement point in the proximity of the MDC901 IC and GaN HEMTs The board temperature sensor is a NTC thermistor placed just below the MDC901 serving as a confirmation point of the IC temperature and provides insight into the GaN half...

Страница 14: ...Vin 15 42 V Vbus 0 50 V Absolute max of 100V including ringing Fsw PWM 0 100 to 1000 1000 kHz Iout 0 30 A Board temperature 90 C Do not exceed 90 C on any component under operating conditions All voltage values are referenced respective to GND Inductor losses The power inductor used in the MDC901 EVBHB board is a Würth Elektronik type 7443630140 with a saturation current of 60A Depending on the op...

Страница 15: ...𝑅𝑑𝑐 𝐼𝑑𝑐 2 Figure 8 AC losses of the power inductor on the EVB Figure 9 depicts the inductor losses in a few typical applications Vbus 48V 25 to Vout 3 3V 12V Figure 9 AC losses of the power inductor on the EVB in a few typical conversion ratio applications 0 1 1 0 1 E 05 1 E 06 1 E 07 Pac W frequency Hz measured AC power loss of 1 4 µH WE 7443630140 0 1 1 10 1 E 05 1 E 06 Pac W frequency Hz 60V to...

Страница 16: ... application sweeping over a switching frequency range from 300 to 700 kHz and an output current Iout from 0 5 A to 30 A with the heatsink attached and fan turned on Efficiency Peak efficiency is obtained at 500kHz at 96 5 keeping the output voltage constant at 12V Power Losses The efficiency can be represented by the power loss value which is key in defining the board operating range and the nece...

Страница 17: ...ibed in Temperature Measurements Storage Conditions The EVB is best stored in the original packaging under room temperature with dry conditions After testing and proper de energizing cool down time the EVB can be placed in the large compartment of the foam insert the EVB spacer studs align with the holes in the foam to better secure the EVB during storage and transportation Normal ESD handling pre...

Страница 18: ...ice on page 20 Page 18 Appendix EVB Schematic Bill of Materials Available upon request please contact support mindcet com PCB Design Gerber Files For assistance in accelerating the design in phase the EVB layout files are available upon request For the most recent version please contact support mindcet com ...

Страница 19: ... to electrostatic discharge customer shall follow proper IC Handling Procedures Customer acknowledges and agrees that it is solely responsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of MinDCet NV components in its applications notwithstanding any applications related information or support that may be provided by MinDCet NV Cust...

Страница 20: ...ed for use in areas such as military aerospace aviation nuclear control submarine transportation automotive control train control ship control transportation signal disaster prevention medical public information network etc Customers shall inform MDC about the intent of such usage before design in stage In certain customer applications requiring a very high level of safety and in which the malfunc...

Страница 21: ...ing procedure of the Product Termination Notification PTN according to the JEDEC Standard we will inform at an early stage about inevitable product discontinuance According to this we cannot guarantee that all products within our product range will always be available Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product av...

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