18. Manufacturing information
18.1. Moisture sensitivity level
This wireless connectivity product is categorized as JEDEC Moisture Sensitivity Level 3 (MSL3),
which requires special handling.
More information regarding the MSL requirements can be found in the IPC/JEDEC J-STD-020
standard on www.jedec.org.
More information about the handling, picking, shipping and the usage of moisture/reflow
and/or process sensitive products can be found in the IPC/JEDEC J-STD-033 standard on
18.2. Soldering
18.2.1. Reflow soldering
Attention must be paid on the thickness of the solder resist between the host PCB top
side and the modules bottom side. Only lead-free assembly is recommended according
to JEDEC J-STD020.
Profile feature
Value
Preheat temperature Min
T
S Min
150 °C
Preheat temperature Max
T
S Max
200 °C
Preheat time from T
S Min
to T
S Max
t
S
60 - 120 seconds
Ramp-up rate (T
L
to T
P
)
3 °C / second max.
Liquidous temperature
T
L
217 °C
Time t
L
maintained above T
L
t
L
60 - 150 seconds
Peak package body temperature
T
P
see table below
Time within 5 °C of actual peak temperature
t
P
20 - 30 seconds
Ramp-down Rate (T
P
to T
L
)
6 °C / second max.
Time 20 °C to T
P
8 minutes max.
Table 26: Classification reflow soldering profile, Note: refer to IPC/JEDEC J-STD-020E
Package thickness
Volume mm
3
<350
Volume mm
3
350-2000
Volume mm
3
>2000
< 1.6 mm
260 °C
260 °C
260 °C
1.6 mm - 2.5 mm
260 °C
250 °C
245 °C
> 2.5 mm
250 °C
245 °C
245 °C
Table 27: Package classification reflow temperature, PB-free assembly, Note: refer to IPC/-
JEDEC J-STD-020E
Proteus-e reference manual version 0.3
© November 2021
www.we-online.com/wireless-connectivity
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