VXI Technology, Inc.
16
CT-100B Introduction
C
OOLING
S
PECIFICATIONS
C
OOLING
R
EQUIREMENTS
(TBD)
60 W/slot for a 10°C Rise
80 W/slot for a 15°C Rise
A
IR
F
LOW
P
ATH
Air is drawn into the chassis from the rear and is pressurized below the cards.
The air is then distributed across all slots along the total length of each slot and
is exhausted through the top of the mainframe. When the mainframe is rack
mounted, allow approximately 2 inches (50 mm) of clearance at the top and rear
for proper airflow.
0.0
1.0
2.0
0
2.0
4.0
6.0
8.0
0.5
1.5
2.5
Pr
e
ss
u
re
D
rop
-
m
m
H
2
O
Airflow - Liters/Sec
* Covers all slots, unrestricted
F
IGURE
1.3 C
OOLING
C
APACITY FOR
CT-100B (T
YPICAL
)
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