Low power WIFI module user manual
Jinan USR IOT Technology Limited
Page 60/72
5. PACKAGE INFORMATION
5.1.
Recommended Reflow Profile
Figure 33. Reflow Soldering Profile
Table 11
Reflow Soldering Parameter
Note:
1. Recommend to supply N2 for reflow oven.
2. N2 atmosphere during reflow (O2<300ppm)
5.2.
Device Handling Instruction (Module IC SMT Preparation)
1. Shelf life in sealed bag: 12 months, at <30
℃
and <60% relative
humidity (RH)
2. After bag is opened, devices that will be re-baked required after
last baked with window time 168 hours.
3. Recommend to oven bake with N2 supplied
4. Recommend end to reflow oven with N2 supplied
5. Baked required with 24 hours at 125+-5
℃
before rework process for
two modules, one is new module and two is board with module
6. Recommend to store at
≦
10% RH with vacuum packing
7. If SMT process needs twice reflow:
(1) Top side SMT and reflow
(2) Bottom side SMT and reflow
Case 1: Wifi module mounted on top side. Need to bake when bottom
side process over 168 hours window time, no need to bake within 168
hours
Case 2: Wifi module mounted on bottom side, follow normal bake rule
before process
NO.
Item
Temperature (Degree)
Time(Sec)
1
Reflow Time
Time of above
220
35~55 sec
2
Peak-Temp
260 max