UM4B0 User Manual
24
8
Production Requirement
Recommended thermal cycle curve is as follows:
Figure 8-1 Soldering Temperature
Temperature rising stage
Rising slope: Max. 3
℃
/s
Rising temperature range:50
℃
-150
℃
Preheating stage
Preheating time: 60 – 120 s
Preheating temperature range: 150 - 180
℃
Reflux Stage
Over melting temperature (217
℃
) time: 40 – 60 s
Peak temperature: no higher than 245
℃
Cooling Stage
Cooling slope: Max. 4
℃
/ s
Notes
：
In order to prevent fall off during soldering of the modules, please avoid soldering the
module in the back of the Board during design, that is, better not to go through soldering cycle
twice.
The setting of temperature depends on many factors, such as type of Board, solder
paste type, solder paste thickness, etc. Please also refer to the relevant IPC standards and
indicators for solder paste.
Since the lead soldering temperatures are relatively low, if using this soldering method,
please give priority to other components on the Board.
