ZOE-M8 series - Hardware integration manual
UBX-16030136 - R09
Product handling and soldering
Page 26 of 34
Production information
3.4
Soldering
3.4.1
Soldering paste
Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the
soldering process has taken place.
The paste-mask geometry for applying soldering paste should meet the recommendations given in
section 2.12.2.
3.4.2
Reflow soldering
Preheat/ Soak temperature min.
Preheat/ Soak temperature max.
Preheat/ Soak time from T
smin
to T
smax
T
smin
T
smax
T
s
(T
smin
to T
smax
)
150 °C
180 °C
90 to 110 seconds
Liquidus temperature
Time maintained above T
L
T
L
t
L
217 °C
40 to 60 seconds
Peak package body temperature
T
P
250 °C
Average ramp-up rate (T
smax
to T
P
)
0.8 °C/ second max.
Time 5 °C…-5 °C of T
P
20 to 40 seconds
Ramp-down rate (T
P
to T
L
)
6 °C/ second max.
Time 25 °C to T
P
8 minutes max.
Table 5: Recommended conditions for reflow process
The peak temperature must not exceed 255 °C. The time above 245 °C must not exceed 40 seconds.
☞
ZOE-M8 GNSS SiPs must not be soldered with a damp heat process.
3.4.3
Optical inspection
After soldering the SiPs, consider an optical inspection step to check whether the SiP is properly
aligned and centered over the pads.
3.4.4
Repeated reflow soldering
Only single reflow soldering process is recommended.
3.4.5
Wave soldering
Base boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices require wave soldering to solder the THT components. Only a single wave
soldering process is encouraged for boards populated with ZOE-M8 GNSS SiPs.
3.4.6
Rework
Not recommended.
3.4.7
Use of ultrasonic processes
Some components on the ZOE-M8 GNSS SiPs are sensitive to ultrasonic waves. Use of any ultrasonic
processes (cleaning, welding) may cause damage to the GNSS receiver.
☞
u-blox offers no warranty against damages to the ZOE-M8 GNSS SiPs caused by any ultrasonic
processes.
