ZOE-M8 series - Hardware integration manual
UBX-16030136 - R09
Design-in
Page 20 of 34
Production information
2.12.1
Footprint
Figure 13: Recommended footprint (bottom view)
Symbol
Typical [mm]
e
0.50
g
0.25
f
0.25
D1
4.50
E1
4.50
P
0.27 diameter
Table 4: Footprint dimensions
2.12.2
Paste mask
The paste mask shall be same as the copper pads with a paste thickness of 80 µm.
☞
These are recommendations only and not specifications. The exact geometry, distances, stencil
thicknesses and solder paste volumes must be adapted to the customer’s specific production
processes (for example, soldering).
2.12.3
Placement
A very important factor in achieving maximum GNSS performance is the placement of the receiver on
the PCB. The connection to the antenna must be as short as possible to avoid jamming into the very
sensitive RF section.
Make sure that RF-critical circuits are clearly separated from any other digital circuits on the system
board. To achieve this, position the receiver digital part towards your digital section of the system
PCB.
2.13
Layout design-in: Thermal management
During design-in do not place the module near sources of heating or cooling. The receiver oscillator is
sensitive to sudden changes in ambient temperature which can adversely impact satellite signal
tracking.
Sources can include co-located power devices, cooling fans or thermal conduction via the
PCB.
Take into account the following questions when designing in the module.
Is the receiver placed away from heat sources?
Is the receiver placed away from air-cooling sources?
Is the receiver shielded by a cover/case to prevent the effects of air currents and rapid
environmental temperature changes?
