NINA-B2 series - System integration manual
UBX-18011096 - R05
Handling and soldering
Page 27 of 35
C1- Public
4.3
Reflow soldering process
NINA-B2 series modules are surface mount modules supplied on a FR4-type PCB with gold-plated
connection pads. The modules are produced in a lead-free process using lead-free soldering paste.
The thickness of solder resist between the top-side of the host PCB and the bottom-side of the
NINA-B2 series module must be considered for the soldering process.
NINA-B2 series modules are compatible with industrial reflow profile for RoHS solders, and "No Clean"
soldering paste is strongly recommended.
The reflow profile used is dependent on the thermal mass of the entire populated PCB, the heat
transfer efficiency of the oven, and the particular type of solder paste that is used. The optimal
soldering profile must be trimmed for the specific process and PCB layout.
⚠
Target values in Table 8 should be taken as general guidelines for a Pb-free process. For further
information, see also the JEDEC J-STD-020C standard.
Process parameter
Unit
Value
Pre-heat
Ramp up rate to T
SMIN
K/s
3
T
SMIN
°C
150
T
SMAX
°C
200
t
S
(from +25 °C)
s
150
t
S
(Pre-heat)
s
60 to 120
Peak
T
L
°C
217
t
L
(time above T
L
)
s
40 to 60
T
P
(absolute max)
°C
245
Cooling
Ramp-down from T
L
K/s
4
Allowed soldering cycles
-
2
Table 8: Recommended reflow profile
Figure 9: Reflow Profile
Lower value of T
P
and slower ramp down rate (2 – 3 °C/sec) is preferred.
