NEO-D9S - Integration manual
4.7.3.3 Paste mask
Figure 25: NEO-D9S suggested paste mask
To improve the wetting of the half vias, reduce the amount of solder paste under the module and
increase the volume outside of the module by defining the dimensions of the paste mask to form a
T-shape (or equivalent) extending beyond the copper mask.
4.7.4 Layout guidance
The presented layout guidance reduces the risk of performance issues at design level.
4.7.4.1 RF In trace
The RF In trace has to work in the middle L-band frequencies.
For FR-4 PCB material with a dielectric permittivity of for example 4.7, the trace width for the 50 Ω
line impedance can be calculated.
Figure 26: Microstrip trace width
A grounded co-planar RF trace is recommended as it provides the maximum shielding from noise
with adequate vias to the ground layer.
UBX-19026111 - R07
4 Design
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