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NEO-M8P - Hardware Integration Manual 

UBX-15028081 - R05 

Early Production Information 

Contents

 

 

 

Page 3 of 27

 

Contents 

Contents .............................................................................................................................. 3

 

1

 

Hardware description .................................................................................................. 5

 

1.1

 

Overview .............................................................................................................................................. 5

 

1.2

 

Configuration ....................................................................................................................................... 5

 

1.3

 

Connecting power ................................................................................................................................ 5

 

1.3.1

 

VCC: Main supply voltage ............................................................................................................. 5

 

1.3.2

 

V_BCKP: Backup supply voltage .................................................................................................... 5

 

1.3.3

 

VDD_USB: USB interface power supply .......................................................................................... 6

 

1.3.4

 

VCC_RF: Output voltage RF ........................................................................................................... 6

 

1.4

 

Communication interfaces .................................................................................................................... 6

 

1.4.1

 

UART ............................................................................................................................................. 6

 

1.4.2

 

USB ............................................................................................................................................... 6

 

1.4.3

 

Display Data Channel (DDC) .......................................................................................................... 7

 

1.4.4

 

SPI ................................................................................................................................................. 7

 

1.4.5

 

TX Ready signal ............................................................................................................................. 7

 

1.5

 

I/O pins ................................................................................................................................................. 8

 

1.5.1

 

RESET_N: Reset input .................................................................................................................... 8

 

1.5.2

 

EXTINT: External interrupt input ..................................................................................................... 8

 

1.5.3

 

SAFEBOOT_N: input ...................................................................................................................... 8

 

1.5.4

 

D_SEL: input .................................................................................................................................. 8

 

1.5.5

 

LNA_EN: Antenna ON (LNA enable), output .................................................................................. 8

 

1.5.6

 

TIMEPULSE: output ........................................................................................................................ 8

 

1.5.7

 

RTK_STAT: output ......................................................................................................................... 8

 

1.5.8

 

GEOFENCE_STAT: output .............................................................................................................. 8

 

1.5.9

 

Electromagnetic interference on I/O lines ....................................................................................... 8

 

2

 

Design ......................................................................................................................... 10

 

2.1

 

Pin description .................................................................................................................................... 10

 

2.1.1

 

Pin name changes ....................................................................................................................... 10

 

2.2

 

Minimal design ................................................................................................................................... 11

 

2.3

 

Layout: Footprint and paste mask ....................................................................................................... 11

 

2.4

 

Antenna ............................................................................................................................................. 12

 

2.4.1

 

Antenna design with passive antenna ......................................................................................... 12

 

2.4.2

 

Active antenna design ................................................................................................................. 13

 

3

 

Product handling ........................................................................................................ 15

 

3.1

 

Packaging, shipping, storage and moisture preconditioning ............................................................... 15

 

3.2

 

Soldering ............................................................................................................................................ 15

 

3.3

 

EOS/ESD/EMI precautions ................................................................................................................... 18

 

3.4

 

Applications with cellular modules ...................................................................................................... 22

 

Содержание NEO-M8P-2

Страница 1: ...n in and feature information for the high accuracy NEO M8P modules Base and rover module variants together provide a high precision cm level RTK position solution Each module contains the u blox M8 co...

Страница 2: ...FW3 01 HPG1 40 N A NEO M8P NEO M8P 2 11 FLASH FW3 01 HPG1 40 N A NEO M8P NEO M8P 0 10 FLASH FW3 01 HPG1 40 PCN UBX 17023320 NEO M8P NEO M8P 2 10 FLASH FW3 01 HPG1 40 PCN UBX 17023320 u blox reserves...

Страница 3: ...O pins 8 1 5 1 RESET_N Reset input 8 1 5 2 EXTINT External interrupt input 8 1 5 3 SAFEBOOT_N input 8 1 5 4 D_SEL input 8 1 5 5 LNA_EN Antenna ON LNA enable output 8 1 5 6 TIMEPULSE output 8 1 5 7 RT...

Страница 4: ...ual UBX 15028081 R05 Early Production Information Contents Page 4 of 27 Appendix 24 A 1 Recommended parts 24 A 2 Design in recommendations in combination with cellular operation 25 Related documents 2...

Страница 5: ...upply is not interrupted For the NEO M8P module the configuration can be saved permanently in SQI flash 1 3 Connecting power The NEO M8P high precision GNSS modules have up to three power supply pins...

Страница 6: ...nchronous operation are not supported 1 4 2 USB A USB version 2 0 FS Full Speed 12 Mb s compatible interface is available for communication as an alternative to the UART The USB_DP integrates a pull u...

Страница 7: ...and SCL have internal pull up resistors For more information about the DDC implementation see the u blox 8 u blox M8 Receiver Description Including Protocol Specification 2 For bandwidth information...

Страница 8: ...configured as one pulse per second by default For more information on programming this function see the u blox 8 u blox M8 Receiver Description including Protocol Specification 2 1 5 7 RTK_STAT outpu...

Страница 9: ...the GNSS antenna see Figure 14 To avoid interference through improperly shielded lines it is recommended to use series resistors e g R 20 ferrite beads e g BLM15HD102SN1 or inductors e g LQG15HS47NJ0...

Страница 10: ...ve open if not used If pin 2 low SPI MOSI USB USB_DM 5 I O USB I O line USB bidirectional communication pin Leave open if unused USB_DP 6 I O USB I O line System TIMEPULSE 3 O Timepulse Signal Configu...

Страница 11: ...modules These are recommendations only and not specifications Note that the copper and solder masks have the same size and position To improve the wetting of the half vias reduce the amount of solder...

Страница 12: ...recommended It is also recommended that the Rover antenna is positioned away from any potential reflectors on the vehicle will give the best overall results Exercise care with Rover vehicles that emit...

Страница 13: ...voltage Ensure the LNA has enough bandwidth to amplify all the required satellite signals An external LNA is only required if the antenna is far away In that case the LNA has to be placed close to th...

Страница 14: ...VCC_RF voltage does not match with the supply voltage of the active antenna use a filtered external supply as shown in Figure 9 To ensure that the maximum DC input voltage at the LNA input is not exc...

Страница 15: ...on the connectors half vias should meet the appropriate IPC specification Reflow soldering A convection type soldering oven is highly recommended over the infrared type radiation oven Convection heat...

Страница 16: ...ering the NEO M8P module consider an optical inspection step to check whether The module is properly aligned and centered over the pads All pads are properly soldered No excess solder has created cont...

Страница 17: ...ixture soldering e g pins 1 and 15 and then continue from left to right Rework The NEO M8P module can be unsoldered from the baseboard using a hot air gun When using a hot air gun for unsoldering the...

Страница 18: ...ic Interference EMI CMOS devices are more sensitive to such influences because their failure mechanism is defined by the applied voltage whereas bipolar semiconductors are more susceptible to thermal...

Страница 19: ...t electrostatic discharge through the RF input do not touch any exposed antenna area If there is any risk that such exposed antenna area is touched in non ESD protected work area implement proper ESD...

Страница 20: ...SD protection Electrical Overstress EOS Electrical Overstress EOS usually describes situations when the maximum input power exceeds the maximum specified ratings EOS failure can happen if RF emitters...

Страница 21: ...agnetic interference EMI Electromagnetic interference EMI is the addition or coupling of energy causing a spontaneous reset of the GNSS receiver or resulting in unstable performance In addition to EMI...

Страница 22: ...GNSS antenna an additional input filter is required on the GNSS side to reduce the energy coupled from the GSM transmitter Examples of these filters are SAW Filters from Epcos B9444 or B7839 or Murat...

Страница 23: ...systems such as GSM CDMA WCDMA Wi Fi BT etc 0 500 1000 1500 2000 GPS input filter characteristics 0 110 0 500 1500 2000 Frequency M Hz GSM 900 GSM 1800 GSM 1900 Pow er dBm GPS input filter characteri...

Страница 24: ...GLONASS BeiDou Low insertion loss TAI SAW TA0638A GPS GLONASS BeiDou Low insertion loss LNA JRC NJG1143UA2 LNA Low noise figure up to 15 dBm RF input power Inductor Murata LQG15HS27NJ02 L 27 nH Imped...

Страница 25: ...na SAW LNA SAW On chip LNA SAW chip external Passive GNSS Antenna Active GNSS Antenna 2G cellular 3G 4G cellular 2G 3G 4G cellular MAX 6 Any NEO 6 Any LEA 6 Any EVA 7 M MAX 7 C W Q NEO 7 N M P EVA M8...

Страница 26: ...s in u blox wireless modules Doc No GSM G1 CS 09007 6 u blox 7 to u blox 8 M8 Software Migration Guide Doc No UBX 15031124 For regular updates to u blox documentation and to receive product change not...

Страница 27: ...ap u blox com Regional Office China Beijing Phone 86 10 68 133 545 E mail info_cn u blox com Support support_cn u blox com Regional Office China Chongqing Phone 86 23 6815 1588 E mail info_cn u blox c...

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