GPS Receiver
A1037-A
7 Mounting
This chapter covers the mounting of the A1037-A.
7.1 Proposed Footprint for Soldering
The following proposal of a footprint for soldering is assuming a stencil thickness of
150µm.
³
marks the center of the through holes.
Figure 8: Soldering footprint proposal A1037-A
Please note that copper and solder paste footprint are identical. The final footprint
has to be evaluated and qualified by the manufacturer according to the specific
processes.
7.2 Recommended Profile for Reflow Soldering
Typical values for reflow soldering of the module in convection or IR/convection ov-
ens are as follows:
Peak temperature
245
°
C
Average ramp up rate to Peak (183
°
C to Peak)
3
°
C / second max.
Preheat temperature 125 (
±
25
°
C)
120 seconds max.
Temperature maintained above 183
°
C
60 … 150 seconds
Time within 5
°
C of actual peak temperature
10 … 20 seconds
Ramp Down rate
6
°
C / second max.
Time 25
°
C to peak temperature
6 minutes max.
Table 8: Reflow soldering profile A1037-A
As results of soldering may vary among different soldering systems and types of
solder and depend on additional factors like density and types of components on
board, the values above should be considered as a starting point for further optimi-
zation.
Page 18 of 29
User’s Manual
V2.0 - 03/07
