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4.5 Thermal Interface Material
There are two types of
thermal interface materials
designed for use with the
processors.
The most common material
comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat sink
on the processor.
The second type of interface
material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).
NOTE:
Always check with the manufacturer of the heat sink & processor to
ensure that the thermal interface material is compatible with the processor and
meets the manufacturer’s warranty requirements.
Содержание B5556G24EV4HR-2T
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Страница 142: ...http www tyan com 142 5 3 14 Super IO Configuration Super IO Chip Read only ...
Страница 147: ...http www tyan com 147 5 3 15 1 Sensor Data Register Monitoring Read only ...
Страница 148: ...http www tyan com 148 5 4 Chipset Menu North Bridge System Agent SA Parameters South Bridge South Bridge Parameters ...
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Страница 167: ...http www tyan com 167 Enables expert users to modify Secure Boot Policy variables without full authentication ...
Страница 168: ...http www tyan com 168 5 6 1 1 Restore Factory Keys Restore Factory Keys Press Yes to proceed No to cancel ...
Страница 175: ...http www tyan com 175 5 7 1 USB Device BBS Priorities Boot Option 1 Sets the system boot order Device Name Disabled ...
Страница 176: ...http www tyan com 176 5 7 2 Hard Drive BBS Priorities Boot Option 1 Sets the system boot order Device Name Disabled ...
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