HN440 USER’S GUIDE
2 2 I n s t a l l a t i o n
There are two versions of the Pentium
®
II SECC2 package:
PLGA (Plastic Land Grid Array) and the more recent OLGA
(Organic Land Grid Array). The arrangement of processor-
side components on the substrate is slightly different in each
case, which may necessitate different heatsinks. Ensure that
the heatsink is appropriate for your SECC2 package.
Inserting the processor
1.
Ensure that the system is turned off and that the AC
power cord is unplugged.
2.
Raise the support arms of the Universal Retention
Mechanism to their upright positions. (The arms of the
URM are folded down during shipment.)
3.
With the heatsink facing in toward the motherboard,
insert the processor package into the URM. The support
arms guide the package so that it is positioned correctly
over the Slot 1 processor connector.
4.
Push the processor package gently but firmly into the
Slot 1 connector until it is fully inserted. A SECC
package has two catches on the top that engage with the
URM support arms when the package is correctly
inserted – you will hear a click when this happens.
5.
If your SECC package heatsink requires the additional
mechanical support bracket (mentioned above), insert
the removable locking bar. The bar slides over the
bottom fins of the heatsink and snaps onto the two outer
posts on the base. The two inner posts on the base act as
guides only.
6.
Attach the fan lead to the processor fan connector
[PL15] on the motherboard (item 20 on page 10). If the
fan has only a two-pin plug, ensure it is connected
across pins 1 and 2.
Caution
The processor requires a continuous airflow when in
operation.