HN440 USER’S GUIDE
I n s t a l l a t i o n 2 1
3.
Fully engage one pair of heatsink clip legs with the
corresponding holes in the heatsink itself. Note that the
heatsink and substrate holes are slightly offset to ensure
good locking grip between the two.
4.
Using a non-metallic tool, push the remaining pair of
clip legs into the heatsink. Do not bend or apply pressure
directly to the SEPP, and take care not to scratch the
surface of the SEPP substrate.
Pentium
®
II processor in a SECC (Single Edge Contact
Cartridge)
The SECC package is fully enclosed by a plastic cover and a
thermal plate. Depending on the manufacturer, the heatsink
may attach to the thermal plate by either metal spring-clips,
thermal tape or Rivscrews. Clip and tape fastenings are
straightforward to apply if you follow the heatsink
manufacturer’s instructions carefully. Rivscrews require
special tools to insert and remove; they are typically used for
securing heatsinks in industrial quantities.
Some SECC heatsinks require an additional support bracket.
The bracket has two pieces: a base that clips into the
motherboard and a removable bar than grips the heatsink,
locking it onto the base. The HN440 motherboard has two
mounting holes for such a bracket (located in front of the
processor slot) but the bracket itself is not supplied nor fitted
as standard. Contact your Trimond™ supplier for more
details.
Note
The SECC packaging for Pentium
®
II processors is now being
superseded by the SECC2 packaging (see below).
Pentium
®
II or Pentium
®
III processor in a SECC2 (Single
Edge Contact Cartridge 2)
The SECC2 package features a plastic cover on one side and
the exposed substrate, with processor core, on the other.
There are four holes through the substrate/cover by which a
heatsink can be attached to the processor side. Typically, the
heatsink has four brass legs that protrude through these holes,
and is secured on the other side by a clip. Alternatively, the
clip may protrude through the package to the heatsink.