155
ղ
˄
card spacer
˅
Push this in the direction of the
arrow to unlock and remove the
P.C.board assembly
Evenly apply the silicon heat sink compound to the heat-sink
surfaces of the IPM, IGBT and rectifier devices.
Caution: It must be ensured that no dust, etc. adheres to the
heat-sink surfaces of the IPM, IGBT and rectifier devices.
Standard for heat silicone heat sink compound:
Manufacturer: Shin-Etsu Chemical Co., Ltd.
Type: G746 or G747
ľ
Screw (M3×20)
Used to secure the IPM, IGBT and rectifiers
Screw tightening torque: 0.55 ±0.1 N
m
ļ
Screw (M4×8)
Used to secure the earth lead wire
Screw tightening torque: 1.2 ±0.1 N
m
ĺ
Screw (M4×8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N
m
Ľ
Screw (M4×10)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N
m
Ĺ
cord clamp
ĸ˄
card spacer
˅
ĺ
Single-touch spacer
Ļ
screws
㸦
M3×20
㸧
IPDU P.C.board
(43H69024)
ĺ
Single-touch spacer
ĺ
Single-touch spacer
Heatsink
ĺ
Single-touch spacer
Ļ
screws
˄
M3×20
˅
First remove the
Screws
յ
, and then
remove the P.C.
board assembly.
P.C.board
ķ˄
card spacer
˅
Push this in the direction of the
arrow to unlock and remove the
P.C.board assembly