Toshiba 29CZ5DE, Руководство по обслуживанию

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LEAD-FREE SOLDER
This product is manufactured using lead-free solder as a part of a movement within the consumer products industry at large
to be environmentally responsible. Lead-free solder must be used in the servicing and repair of this product.
WARNING
This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT!
The melting temperature of lead-free solder is higher than that of leaded solder by 86˚F to 104˚F (30˚C to 40˚C). Use of a
soldering iron designed for lead-based solders to repair product made with lead-free solder may result in damage to the
component and or PCB being soldered. Great care should be made to ensure high-quality soldering when servicing this
product -especially when soldering large components, through-hole pins, and on PCBs - as the level of heat required to
melt lead-free solder is high.
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GREEN PRODUCT PROCUREMENT
The EC is actively promoting the WEEE & RoHS Directives that define standards for recycling and reuse of Waste Electri-
cal and Electronic Equipment and for the Restriction of the use of certain Hazardous Substances. From July 1, 2006, the
RoHS Directive will prohibit any marketing of new products containing the restricted substances.
Increasing attention is given to issues related to the global environmental. Toshiba Corporation recognizes environmental
protection as a key management tasks, and is doing its utmost to enhance and improve the quality and scope of its
environmental activities. In line with this, Toshiba proactively promotes Green Procurement, and seeks to purchase and
use products, parts and materials that have low environmental impacts.
Green procurement of parts is not only confined to manufacture. The same green parts used in manufacture must also be
used as replacement parts.
TABLE OF CONTENTS
CHAPTER 1 GENERAL ADJUSTMENTS
SAFETY INSTRUCTIONS ............................................................................................................................................. 3
SET-UP ADJUSTMENT ................................................................................................................................................. 4
SERVICE MODE ........................................................................................................................................................... 8
DESIGN MODE ........................................................................................................................................................... 11
ELECTRICAL ADJUSTMENTS ................................................................................................................................... 12
CIRCUIT CHECK ......................................................................................................................................................... 13
CHAPTER 2 SPECIFIC INFORMATIONS
SETTING & ADJUSTING DATA ................................................................................................................................... 14
NAMES AND FUNCTIONS OF CONTROLS .............................................................................................................. 15
PROGRAMMING CHANNEL MEMORY ...................................................................................................................... 16
PROCEDURES TO SET HOTEL MODE ..................................................................................................................... 18
CHASSIS AND CABINET REPLACEMENT PARTS LIST ........................................................................................... 19
PC BOARDS BOTTOM VIEW ...................................................................................................................................... 26
TERMINAL VIEW OF TRANSISTORS ........................................................................................................................ 30
CIRCUIT BLOCK DIAGRAM ....................................................................................................................................... 32
SPECIFICATIONS .................................................................................................................................................... END
APPENDIX:
CIRCUIT DIAGRAM