Apalis Carrier Board Design Guide
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Figure 70: PCB bending problem
The figure below shows a cross-section trough of a heat sink, mounted on an Apalis module. The
overall height from carrier board surface to the top of the heat sink is 14mm without a fan. The
additional spacer under the center of the module needs to have a height of 3mm.
Figure 71: Stacking height of heat sink
4.4 Module Size
Figure 72: Module dimension top side (dimensions in mm)
On the bottom side, all modules feature a pad with a diameter of 6mm in the middle of the PCB. A
standoff placed on the carrier board that connects with this location, supports the module if the
cooling solution applies force. At both edges of the module, ten test pads are available. These
pads are used by the module manufacturer for test purposes.
Spacer added
under SoC
Carrier Board
Spacer 8mm
Spacer 3mm
Spacer 3mm
Heats Sink
SoC
1
4m
m
82
3.20
6
2.
60
3.50
24.20
4
5
4
1
3
.7
5
1
.4
5
1.80
1 +/-0.05
2
.9
0
75
25.40