LE940B6 HW User Guide
Rev. 2.02
Page 93 of 111
2020-01-10
Table 37: Solder Profile Characteristics
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3°C/second max
Preheat
– Temperature min (Tsmin)
– Temperature max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak temperature (Tp)
245 +0/-5°C
Time within 5°C of actual peak
Temperature (tp)
10-30 seconds
Ramp-down rate
6°C/second max
Time 25°C to peak temperature
8 minutes max
NOTE:
All temperatures refer to the top side of the package, measured on the
package body surface.
WARNING:
The LE940B6 module withstands one reflow process only.
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