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LE940B6 HW User Guide

Rev. 2.02

Page 90 of 111

2020-01-10

Stencil

Stencil’s apertures layout can be the same as the recommended footprint (1:1). The
suggested thickness of stencil foil is greater than 120 µm.

PCB Pad Design

The solder pads on the PCB are recommended to be of the Non Solder Mask Defined
(NSMD) type.

Figure 26: PCB Pad Design

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Содержание LE940B6

Страница 1: ...B6 HW User Guide Rev 2 2 2020 01 10 P r o v i d e d t o D e k r a u n d e r N D A D i s t r i b u t i o n i s P r o h i b i t e d e x c e p t f o r D e k r a e m p l o y e e s w i t h a N e e d t o k...

Страница 2: ...y Such references or information must not be construed to mean that Titan intends to announce such Titan products programming or services in your country COPYRIGHTS This instruction manual and the Tit...

Страница 3: ...e with the terms of such an agreement II Copyrighted Materials Software and documentation are copyrighted materials Making unauthorized copies is prohibited by law No part of the software or documenta...

Страница 4: ...URPOSE NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT INDIRECT INCIDENTAL SPECIAL EXEMPLARY OR CONSEQUENTIAL DAMAGES INCLUDING WITHOUT LIMITATION LOST PROFITS HOWEVER C...

Страница 5: ...O North America regional variant AT T and T Mobile LE940B6 NV AUTO North America region variant Verizon AT T and T Mobile LE940B6 RW AUTO Rest of World variant Europe APAC Latin America and more LE940...

Страница 6: ...Bands Characteristics 18 Sensitivity 21 LE940B6 Mechanical Specifications 22 2 7 1 Dimensions 22 2 7 2 Weight 22 3 LE940B6 MODULE CONNECTIONS 23 Pin out 23 LE940B6 Signals That Must Be Connected 40 L...

Страница 7: ...6 2 3 Power Supply PCB Layout Guidelines 64 7 ANTENNA S 66 GSM WCDMA TD SCDMA LTE Antenna Requirements 66 GSM WCDMA TD SCDMA LTE Antenna PCB Line Guidelines 66 GSM WCDMA TD SCDMA LTE Antenna Installat...

Страница 8: ...8 General 88 Finishing Dimensions 88 Recommended Footprint for the Application 89 Stencil 90 PCB Pad Design 90 Recommendations for PCB Pad Dimensions mm 91 Solder Paste 92 10 7 1 Solder Reflow 92 11 A...

Страница 9: ...tices 102 RED Regulatory Notices 104 14 SAFETY RECOMMENDATIONS 106 15 ACRONYMS 107 16 DOCUMENT HISTORY 109 P r o v i d e d t o D e k r a u n d e r N D A D i s t r i b u t i o n i s P r o h i b i t e d...

Страница 10: ...rect solutions and common errors to be avoided Obviously this document cannot embrace every hardware solution or every product that can be designed Obviously avoiding invalid solutions must be conside...

Страница 11: ...improvements Titan appreciates feedback from the users of our information Text Conventions The following conventions are used to emphasize specific types of information DANGER Danger This information...

Страница 12: ...tion and text conventions 2 Product Description An overview of the product features 3 LE940B6 Module Connections Pinout configuration and layout 4 Electrical Specifications Specifies electrical values...

Страница 13: ...plication Guide 12 Packing System 13 Conformity Assessment Issues 14 Safety Recommendations 15 Acronyms16 16 Document History P r o v i d e d t o D e k r a u n d e r N D A D i s t r i b u t i o n i s...

Страница 14: ...rers can create products that guarantee fraud prevention and tamper evidence without extra effort for additional security precautions LE940B6 can be self sufficient and serve as a fully integrated sol...

Страница 15: ...hoice of RF bands in each for worldwide coverage of countries and MNOs Well designed form factor 40x40mm accommodating the multiple RF bands in each region variant Digital audio and analog audio codec...

Страница 16: ...specification in the order of a few dB For example receiver sensitivity or maximum output power may be slightly degraded Even so all the functionalities such as call connection SMS USB communication U...

Страница 17: ...2G LE940B6 NA 2 4 5 7 12 29 DL 2 4 5 2 5 LTE Carrier Aggregation 2 5 2 12 2 29 4 4 4 5 4 12 4 29 LE940B6 NV 2 4 5 7 12 13 29 DL 2 4 5 2 5 LTE Carrier Aggregation 2 5 2 12 2 13 2 29 4 4 4 5 4 12 4 13 4...

Страница 18: ...0 B2 1850 1910 1930 1990 Tx 9262 9538 Rx 9662 9938 80 MHz WCDMA 1800 B3 1710 1785 1805 1880 Tx 937 1288 Rx 1162 1513 95 MHz WCDMA AWS B4 1710 1755 2110 2155 Tx 1312 1513 Rx 1537 1738 400 MHz WCDMA 850...

Страница 19: ...80 Tx 19200 19949 Rx 1200 1949 95 MHz LTE AWS B4 1710 1755 2110 2155 Tx 19950 20399 Rx 1950 2399 400 MHz LTE 850 B5 824 849 869 894 Tx 20400 20649 Rx 2400 2649 45 MHz LTE 2600 B7 2500 2570 2620 2690 T...

Страница 20: ...Tx 24150 24449 Rx 6150 6449 41 MHz LTE 1500 B21 1447 9 1462 9 1495 9 1510 9 Tx 24450 24599 Rx 6450 6599 48 MHz LTE 850 B26 814 849 859 894 Tx 26690 27039 Rx 8690 9039 45 MHz LTE 700 B28 703 748 758 80...

Страница 21: ...50 39649 0 MHz LTE TDD 2500 B41 2496 2690 2496 2690 Tx 39650 41589 Rx 39650 41589 0 MHz Sensitivity LE940B6 maximum sensitivity levels are as follows exact performance figures will be specified at a l...

Страница 22: ...are Length 40 mm 0 20 mm tolerance Width 40 mm 0 20 mm tolerance Thickness 3 0 mm 0 15 mm tolerance with label 2 7 2 Weight The nominal weight of the LE940B6 module is 11 gram P r o v i d e d t o D e...

Страница 23: ...C105 RTS I Input for Request To Send signal RTS from DTE 1 8V AK19 C106 CTS O Output for Clear To Send signal CTS to DTE 1 8V AG18 C107 DSR O Output for Data Set Ready signal DSR to DTE 1 8V AC18 C108...

Страница 24: ...est Action Group E4 JTAG_TDI I JTAG_TDI 1 8V F3 JTAG_RESOUT_ N O JTAG_RESOUT 1 8V F5 JTAG_TRIGOUT JTAG_TRIGOUT 1 8V G2 JTAG_RTCK O JTAG_RTCK 1 8V H3 JTAG_TCK I JTAG_TCK 1 8V J2 JTAG_TRST_N I JTAG_TRST...

Страница 25: ...1 8 2 9 V B11 SIMRST1 O External SIM signal Reset 1 8 2 9 V SIM Card Interface 2 D15 SIMVCC2 External SIM signal Power supply for the SIM 1 8 2 9 V C16 SIMCLK2 O External SIM signal Clock 1 8 2 9 V C...

Страница 26: ...V D11 DVI_WA0 O Digital Voice interface WA0 master output 1 8V SPI Serial Peripheral Interface K19 SPI_MOSI O SPI data Master output Slave input 1 8V M19 SPI_MISO I SPI data Master input Slave output...

Страница 27: ...GPIO_21 I O GPIO_21 1 8V K1 GPIO_22 I O GPIO_22 1 8V Analog to Digital Converter D5 ADC_IN1 AI Analog to Digital Converter Input 1 Analog E6 ADC_IN2 AI Analog to Digital Converter Input 2 Analog F7 A...

Страница 28: ...XD 1 I RGMII or RMII RXD 1 2 5 3 3 V AG16 MAC_RXD 2 I RGMII RXD 2 2 5 3 3 V AE16 MAC_RXD 3 I RGMII RXD 3 2 5 3 3 V AC16 MAC_RX_CLK I RGMII Receive Clock 2 5 3 3 V X16 MAC_RXDV_ER I RGMII Receive Data...

Страница 29: ..._LED O Status Indicator LED 1 8V P17 VAUX PWRMON O Supply output for external accessories Power ON Monitor 1 8V H17 VPP I VPP for eFuse Power Supply AP17 VBATT Main Power Supply Digital Section Power...

Страница 30: ...ower Ground A6 GND Ground Ground A12 GND Ground Ground B13 GND Ground Ground B15 GND Ground Ground B17 GND Ground Ground C4 GND Ground Ground C6 GND Ground Ground D3 GND Ground Ground D7 GND Ground Gr...

Страница 31: ...round Ground AA2 GND Ground Ground AB1 GND Ground Ground AC2 GND Ground Ground AE2 GND Ground Ground AF1 GND Ground Ground AG2 GND Ground Ground AH1 GND Ground Ground AJ2 GND Ground Ground AK1 GND Gro...

Страница 32: ...ND Ground Ground AR6 GND Ground Ground AR8 GND Ground Ground AR10 GND Ground Ground AR12 GND Ground Ground AR14 GND Ground Ground AR16 GND Ground Ground AS5 GND Ground Ground AS7 GND Ground Ground AS9...

Страница 33: ...AU15 GND Ground Ground AL2 GND Ground Ground AN2 GND Ground Ground L20 GND Ground Ground N20 GND Ground Ground ZZ19 GND Ground Ground A20 GND Ground Ground AV20 GND Ground Ground ZZ1 GND Ground Ground...

Страница 34: ...GND Ground Ground AV10 GND Ground Ground AV12 GND Ground Ground AV14 GND Ground Ground AV16 GND Ground Ground AV18 GND Ground Ground T8 GND Ground Ground V8 GND Ground Ground X8 GND Ground Ground AA8...

Страница 35: ...101 GND Ground Ground B101 GND Ground Ground D101 GND Ground Ground U101 GND Ground Ground W101 GND Ground Ground Y101 GND Ground Ground AR10 1 GND Ground Ground AT101 GND Ground Ground AV101 GND Grou...

Страница 36: ...eserved J20 Reserved Reserved AN14 Reserved Reserved E8 Reserved Reserved E2 Reserved Reserved D1 Reserved Reserved C2 Reserved Reserved B1 Reserved Reserved C12 Reserved Reserved J4 Reserved Reserved...

Страница 37: ...erved Reserved AA4 Reserved Reserved S17 Reserved Reserved U17 Reserved Reserved AH17 Reserved Reserved Y17 Reserved Reserved AF17 Reserved Reserved AB17 Reserved Reserved W17 Reserved Reserved AD17 R...

Страница 38: ...d ZZ17 Reserved Reserved ZZ9 Reserved Reserved ZZ7 Reserved Reserved ZZ5 Reserved Reserved ZZ3 Reserved Reserved C0 Reserved Reserved E0 Reserved Reserved G0 Reserved Reserved J0 Reserved Reserved AM1...

Страница 39: ...Reserved AV4 Reserved Reserved NOTE When the UART signals are used as the communication port between the host and the modem The DTR pin must be connected to enter LE940B6 power saving mode The RI pin...

Страница 40: ...E2 AF1 AG2 AH1 AJ2 AK1 AK17 AL18 AM17 AM19 AN16 AN18 AP3 AP5 AP7 AP9 AP11 AP13 AP15 AR2 AR4 AR6 AR8 AR10 AR12 AR14 AR16 AS5 AS7 AS9 AS11 AS13 AS15 AT4 AT6 AT8 AT10 AT12 AT14 AT16 AU1 AU5 AU7 AU11 AU15...

Страница 41: ...ct to a test point AD19 RXD_AUX If not used connect to a test point AD1 ANT_1 If not used connect to a 50 Ohm termination AU9 ANT_DIV_1 If not used connect to a 50 Ohm termination S1 ANT_GPS If not us...

Страница 42: ...DVI_TX GPIO_0 1 GND GND GND UART3_ TXD GND GND ANT_DI V_1 9 10 SIMCLK 1 DVI_CL K GPIO_0 2 ETH_IN T_N GND GND GND GND SW_RDY GND GND GND 10 11 RFU SIMRST 1 DVI_WA 0 GPIO_0 3 GND GND GND UART3_ RXD GND...

Страница 43: ...oltage on pin VBATT_PA 0 3 6 0 V Recommended Operating Conditions Table 9 Recommended Operating Conditions Symbol Parameter Min Typ Max Unit Tamb Ambient temperature 40 25 85 C VBATT Battery supply vo...

Страница 44: ...directly to OEM digital logic signals with a level higher than 2 7V for 1 8V CMOS signals 4 3 1 1 8V Standard GPIOs Table 10 Absolute Maximum Ratings Not Functional Parameter Min Max Input level on s...

Страница 45: ...ble 14 Operating Range 2 9V SIM Pads Parameter Min Max Input high level 2 03V 3 1V Input low level 0 3V 0 58V Output high level 2 03V 3 1V Output low level 0 3V 0 58V 4 3 4 USB Table 15 Operating Rang...

Страница 46: ...C Interface Parameter Min Max Input high level 1 7V 2 5V Input low level 0 3V 0 7V Output high level 2V Output low level 0 4V Table 18 Operating Range 3 3V EMAC Interface Parameter Min Max Input high...

Страница 47: ...BATT is removed VBATT input must be at zero volt before VBATT is reapplied Initialization and Activation State After turning on the LE940B6 module a predefined internal boot sequence performs the HW a...

Страница 48: ...ands NOTE Do not use any pull up resistor on the ON_OFF_N line as it is internally pulled up Using a pull up resistor may cause latch up problems on the LE940B6 power regulator and improper powering o...

Страница 49: ...START VBATT 3 4V VAUX PWRMON ON ON_OFF_N LOW 80 ms Hold Time 120 ms ON_OFF_N HIGH VAUX PWRMON ON Delay 25 sec Go to Start AT CMD Modem ON Procedure END N Y Y N Go to HW SHUTDOWN Unconditional N Y P r...

Страница 50: ...AT Command Managing Flow Chart Start AT CMD START Delay 300 ms Enter AT CR AT Answer in 1 sec Start AT CMD END Y Go to Modem ON Procedure Go to HW SHUTDOWN Unconditional N P r o v i d e d t o D e k r...

Страница 51: ...monitor the VAUX PWRMON hardware line When VAUX PWRMON goes low this indicates that the device has powered off NOTE To avoid a back powering effect it is recommended to avoid having any HIGH logic lev...

Страница 52: ...module so a value cannot be defined Usually it will take more than 10 seconds from sending a shutdown command until reaching a complete shutdown The DTE host should monitor the status of VAUX PWRMON...

Страница 53: ...of the Finalization state can differ according to the current situation of the module so a value cannot be defined Usually it will take more than 10 seconds from sending a shutdown command until reach...

Страница 54: ...nal Hardware Reset must always be implemented on the boards but the software must use it only as an emergency exit procedure and not as a normal power off operation NOTE Do not use any pull up resisto...

Страница 55: ...n VAUX PWRMON goes low the device has powered off NOTE Do not use any pull up resistor on the SHDN_N line or any totem pole digital output Using a pull up resistor may cause latch up problems on the L...

Страница 56: ...gure 11 shows a flow chart of the proper turn off procedure Figure 11 Turn Off Procedure P r o v i d e d t o D e k r a u n d e r N D A D i s t r i b u t i o n i s P r o h i b i t e d e x c e p t f o r...

Страница 57: ...n values of LE940B6 for the various available modes Table 20 LE940B6 Current Consumption Mode Average Typ Mode Description Switched Off Switched off 0 1 mA Module supplied but switched Off Idle Mode S...

Страница 58: ...50 Mbps UL with Ethernet cable connection current consumption of Ethernet PHY not included Operative Mode WCDMA WCDMA Voice 800 mA WCDMA voice call Tx 23 dBm WCDMA HSDPA 0 dBm 350 mA WCDMA data call...

Страница 59: ...1900 PL2 500 mA Worst best case current values depend on network configuration not under module control Applied MPR 2dB 16 QAM full RB 3 8V voltage room temperature NOTE Differences in measurement te...

Страница 60: ...ngly on the power source where this power is drained Power sources can be distinguished by three categories 5V input typically PC internal regulator output 12V input typically automotive Battery 6 2 1...

Страница 61: ...lated to the application to be developed due to the fact that the switching frequency can also generate EMC interference For car batteries lead acid accumulators the input voltage can rise up to 15 8V...

Страница 62: ...ator with 12V input Figure 13 Example of Switching Regulator with 12V Input Part 1 Figure 14 Example of Switching Regulator with 12V Input Part 2 P r o v i d e d t o D e k r a u n d e r N D A D i s t...

Страница 63: ...done in a way to avoid polarity inversions when connecting the battery The battery capacity must be at least 500 mAh to withstand the current peaks of 2A The suggested capacity is from 500 mAh to 100...

Страница 64: ...is is not done to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply...

Страница 65: ...ply input cables must be kept separate from noise sensitive lines such as microphone earphone cables P r o v i d e d t o D e k r a u n d e r N D A D i s t r i b u t i o n i s P r o h i b i t e d e x c...

Страница 66: ...andwidth The RF bands supported in each region variant are detailed in Section 2 5 1 RF Bands per Regional Variant Since there is no antenna connector on the LE940B6 module the antenna must be connect...

Страница 67: ...dB Avoid coupling with other signals Cold End Ground Plane of the antenna must be equipotential to the LE940B6 ground pads Furthermore if the device is developed for the US and or Canada market it mus...

Страница 68: ...eference Guide and connect the Diversity pad AU9 to a 50 Ohm termination PCB Guidelines in Case of FCC Certification If FCC certification is required for an application using LE940B6 NA according to F...

Страница 69: ...eometry is shown below Figure 15 Line Geometry 7 5 2 Transmission Line Measurements E5071C NA Full 4 port calibration has been used in this measurement session A calibrated coaxial cable has been sold...

Страница 70: ...s Plot of Line Under Test Figure 17 shows the line input impedance in Smith Chart format once the line has been terminated to a load of 50 Figure 17 Line Input Impedance P r o v i d e d t o D e k r a...

Страница 71: ...sensors audio control UART x1 UART for AT up to 4 8 Mbps x1 UART for diagnosis up to 4 8 Mbps x1 UART for GNSS or external controller up to 4 8 Mbps Audio I F I2S PCM Analog audio GPIO 15 dedicated G...

Страница 72: ...a clock rate of 480 MHz The signal traces must be routed carefully Minimize trace lengths number of vias and capacitive loading The impedance value should be as close as possible to 90 Ohms differenti...

Страница 73: ...r on the application board At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update WARNING Consider placing low capacitance ESD pro...

Страница 74: ...V Standard GPIOs 8 2 1 Modem Serial Port 1 Serial Port 1 is a 1 8V UART having all the 8 RS232 signals It differs from the PC RS232 in the signal polarity RS232 is reversed and levels Table 25 lists t...

Страница 75: ...w control is implemented NOTE According to V 24 Rx Tx signal names refer to the application side therefore on the LE940B6 side these signal are in the opposite direction TXD on the application side wi...

Страница 76: ...ed and levels Table 27 lists the signals of the LE940B6 Serial Port 3 Table 27 Modem Serial Port 3 Signals PAD Signal I O Function Type Comment AM9 UART3_TXD I Serial data input TXD from DTE 1 8V AM11...

Страница 77: ...here are a multitude of them differing in the number of drivers and receivers and in the levels be sure to get a true RS232 level translator not a RS485 or other standards By convention the driver is...

Страница 78: ...e the length of the lines on the application must be taken into account to avoid problems in the case of high speed rates on RS232 The RS232 serial port lines are usually connected to a DB9 connector...

Страница 79: ...x side The LE940B6 module supports Master mode only and cannot be configured as Slave mode Table 28 SPI Signals PAD Signal I O Function Type Comment P19 SPI_CLK O SPI clock output 1 8V M19 SPI_MISO I...

Страница 80: ...nt with the RGMII and RMII specifications The supported RGMII and RMII specification versions are RGMII Version 1 3 dated 12 10 2000 supporting up to 1000 Mbps operation RMII Version 1 2 dated 03 20 1...

Страница 81: ...MII RXD 1 2 5 3 3V AG16 MAC_RXD 2 I RGMII RXD 2 2 5 3 3V AE16 MAC_RXD 3 I RGMII RXD 3 2 5 3 3V AC16 MAC_RX_CLK I RGMII Receive Clock 2 5 3 3V X16 MAC_RXDV_ER I RGMII Receive Data Available Error or RM...

Страница 82: ...e signal input phase Audio G6 MICBIAS AO Microphone bias is 1 9 2 2V Power An application note will be prepared for detailed audio settings 8 5 2 Digital Audio The LE940B6 module can be connected to a...

Страница 83: ...8V 1 mA E10 GPIO_02 I O Configurable GPIO CMOS 1 8V 1 mA F11 GPIO_03 I O Configurable GPIO CMOS 1 8V 3 mA E12 GPIO_04 I O Configurable GPIO CMOS 1 8V 3 mA F13 GPIO_05 I O Configurable GPIO CMOS 1 8V...

Страница 84: ...as interface levels compatible with the 1 8V CMOS levels of the GPIO If the digital output of the device is connected with the GPIO input the pad has interface levels different from the 1 8V CMOS It c...

Страница 85: ...description of this function Table 33 Network Service Availability Indication LED Status Device Status Permanently off Device off Fast blinking Period depends on network condition Registered with powe...

Страница 86: ...res it into a 16 bit word Table 35 ADC Parameters Min Max Units Input voltage range 0 1 2 Volt AD conversion 12 bits 9 4 2 Using the ADC Converter An AT command is available to use the ADC function Th...

Страница 87: ...nnectivity Example eFuse The LE940B6 module needs 1 8 0 05V applied on Pad VPP H17 for eFuses to be programmed The fuse voltage must be applied to VPP H17 prior to the fuse script being started and mu...

Страница 88: ...liant with a standard lead free soldering process as defined in JESD22b102d table 3b The number of reflows must not exceed two This limits Tmax to 245 C Finishing Dimensions P r o v i d e d t o D e k...

Страница 89: ...le These regions are highlighted in Figure 25 It is also suggested as a common rule for an SMT component to avoid having a mechanical part of the application board in direct contact with the module NO...

Страница 90: ...ted thickness of stencil foil is greater than 120 m PCB Pad Design The solder pads on the PCB are recommended to be of the Non Solder Mask Defined NSMD type Figure 26 PCB Pad Design P r o v i d e d t...

Страница 91: ...the pad itself see Figure 28 Figure 28 Inhibit Area for Micro via Holes in pad are allowed only for blind holes and not for through holes Table 36 Recommendations for PCB Pad Surfaces Finish Layer Thi...

Страница 92: ...he described surface plating is better compared to lead free solder paste Solder Paste We recommend using only no clean solder paste to avoid the cleaning of the modules after assembly 10 7 1 Solder R...

Страница 93: ...Temperature TL Time tL 217 C 60 150 seconds Peak temperature Tp 245 0 5 C Time within 5 C of actual peak Temperature tp 10 30 seconds Ramp down rate 6 C second max Time 25 C to peak temperature 8 minu...

Страница 94: ...he LE940B6 itself and the application Testing the performance of the module by connecting it with an external computer Depending on the customer application these test pads include but are not limited...

Страница 95: ...power lines must be considered carefully and the capacitance of the capacitors must be selected accordingly The capacitor will also prevent ripple of the power supplies and the switching noise caused...

Страница 96: ...he components Figure 30 SIM Schematics NOTE An external pull up resistor on SIMIO is not required The LE940B6 module contains an internal pull up resistor on SIMIO Table 38 lists the values of C1 to b...

Страница 97: ...gn of the host system used to download or upgrade the Titan software and to debug the LE940B6 module when it is already mounted on a host system For downloading or upgrading the Titan software In the...

Страница 98: ...s shorted to ground or the battery of the vehicle for fault tracing Basically antenna detection is performed by means of its DC characteristics splitting the DC and RF paths Refer to Ref 5 Titan Anten...

Страница 99: ...so environmentally sustainable There are 2 two antistatic rubber bands that enclose each envelope The carton box is rigid thus offering mechanical protection The carton box has one flap across the en...

Страница 100: ...01 10 Each tray contains 24 modules as shown in Figure 31 Figure 31 Tray Packing P r o v i d e d t o D e k r a u n d e r N D A D i s t r i b u t i o n i s P r o h i b i t e d e x c e p t f o r D e k...

Страница 101: ...C Moisture Sensitivity The LE940B6 module is a Moisture Sensitive Device Level 3 in accordance with standard IPC JEDEC J STD 020 Observe all of the requirements for using this kind of components Calcu...

Страница 102: ...aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout br...

Страница 103: ...6NA Contains IC 25635 LE940B6NA The grantee s FCC IC ID can be used only when all FCC IC compliance requirements are met This device is intended only for OEM integrators under the following conditions...

Страница 104: ...compliance with the Radio and EMF essential requirements of the RED This module must not be incorporated into any other device or system without retesting for compliance as multi radio and combined e...

Страница 105: ...uipment WEEE This symbol means that according to local laws and regulations your product and or its battery shall be disposed of separately from household waste When this product reaches its end of li...

Страница 106: ...king carefully the instructions for its use Do not insert or remove the SIM when the product is in power saving mode The system integrator is responsible for the functioning of the final product there...

Страница 107: ...GNSS Global navigation satellite system GPIO General purpose input output GPRS General packet radio services GPS Global positioning system GSM Global system for mobile communications I2C Inter integr...

Страница 108: ...eiver transmitter UMTS Universal mobile telecommunications system USB Universal serial bus WCDMA Wideband code division multiple access WCI Wireless Coexistence Interface P r o v i d e d t o D e k r a...

Страница 109: ...onal Variant Sec 2 5 2 Updated Table 5 RF Bands Characteristics Sec 5 3 Fixed figure 7 and 8 Power off timing Sec 6 1 Updated table 21 LE940B6 Current Consumption Sec 13 2 Added RED Regulatory Notices...

Страница 110: ...ction of Hardware Shutdown Sec 5 3 3 Updated the Unconditional reset Hold time Sec 6 1 Updated Table 21 Current Consumption in various modes Sec 6 2 2 Updated the Thermal Design Guidelines Sec 8 1 USB...

Страница 111: ...ec 8 1 Updated note and figure for USB Sec 8 2 Various updates about the Serial Ports Sec 8 4 Updates about the Ethernet interface Sec 8 6 Updated the GPIO drive strength Sec 11 5 Updated the Download...

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