Themis RES-32XR3/FIO, Руководство по установке

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RES-32XR3/FIO Installation Manual
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Themis Computer
The 3RU-high (5.25”) RES-32XR3/FIO has been designed to fit into a standard 19”
rack and is provided with rack-mount brackets with handles.
Optional rack-mount
slides are also available. The RES-32XR3/FIO is rugged enough to withstand
extreme shock (up to 35G), temperature, and EMI as that associated with such
demanding markets as the military, aerospace, and telecommunications industries.
The two quad-core/dual-core Intel Xeon CPUs operate up to 6.4 GT/s (with a 1333-
MHz front-side system bus) and support up to 192 GigaBytes of DDR3 ECC FB-
DIMM memory modules. The RES-32XR3/FIO is based on the functionality and
capability of the following Intel chipset:
• Intel 5520 (Tylersburg) chipset
• 2x IOH-36D (Southbridge)
An overview of RES-32XR3/FIO design and specifications is given in Chapter 1,
"Overview and Specifications", of this manual.
Table 3. RES- x 2XR3/FIO 16” Chassis Manual Matrix (AC and DC Power Supplies)
Mother-
board
CPU
Soc
kets
RES-32XR3/FIO Manual P/N RES-22XR3/FIO Manual P/N
X8DAH+-F * 2 117611-024
X8DTU-F 2 117664-024
Naming Key: X8 uvwxyz
z
System RES- x 2XR3S and RES- x 1XR3, where
x = 3, 2, or 1
*RES-32XR3/FIO motherboard X8DAH+-F supports both audio and video;
however, the naming key does not contain a “T” in the title.
u: D = Double CPU sockets
S = Single CPU socket
v: A = Sound chip; no graphics chip
T = Graphics chip; no sound chip
w: Not applicable
x: i = SATA only
3 = SAS 1.0
6 = SAS 2.0
y: LN4 = Extra gigabit Ethernet controller for two extra ports
z: F = IPMI
blank = No IPMI