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LGA DevKit User Guide
9.3 Errata/Troubleshooting
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lga_devkit_ug_v03
2020-05-29
Public / Released
Page 34 of 36
9.3
Errata/Troubleshooting
PCB22/23 with DSB-Mini as Expander Board - ON LED
With the LGA DevKit version B22/23 - built in smaller quantities - a current back feeding causes
a constantly glowing WHITE ON LED. There is no impact in functionality.
PCB B22 Module Rotation Detecting Limited
The LGA DevKit's PCB revision B22 - built in a smaller quantity - has a limited rotation detect-
ing. If the DevKit is powered by native USB and the module is inserted upside down, the error
detecting is limited and may allow drawing a limited current (max 20mA) into pad#11/212. The
module may get damaged. This limitation is fixed in B24.
PCB B22 Footprint Detection Limited
The LGA DevKit's PCB revision B22 - built in a smaller quantity - has a limited footprint detec-
tion. Modules with bold lettering "QUALCOMM" (e.g., EXS81) or wrongly positioned RohS sym-
bol (e.g., ELS61/81) on the module's underside, might be detected as a wrong footprint and will
therefore not be powered-up. This limitation has been improved in conjunction with the socket’s
module footprint.
PCB B22 Error LED/ TXD0 LED
The LGA DevKit's PCB revision B22 has a softly glowing error LED. Also, when no module is
inserted the TXD0 LED glows softly. This optical defect is fixed in B24.
PCB B22 Marking
With the LGA DevKit's PCB revision B22 the following markings are swapped:
•
DAT and CLK at the GPIO pin headers
•
IO13 and VDLP at the FREE GPIOS pin headers
RF Path Matching
The LGA DevKit socket characteristics were improved with regard to module supply path re-
sistance and RF characteristics. There is a smaller quantity built without these improvements.
Socket (old)
Socket (new)
Improved spring contacts
