Thales Cinterion DGL61-W, Описание аппаратного интерфейса

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Cinterion ® DGL61-W Hardware Interface Description
Contents
42
t
DGL61-W_HID_v07 2021-02-17
Public / Preliminary
Page 3 of 42
Contents
0 Document History ...................................................................................................... 7
1 Introduction ................................................................................................................. 9
1.1 Related Documents ........................................................................................... 9
1.2 Terms and Abbreviations ................................................................................. 10
1.3 Regulatory and Type Approval Information ..................................................... 12
1.3.1
Directives and Standards.................................................................... 12
1.3.2 Safety Precautions.............................................................................. 15
1.3.3 Disposal .............................................................................................. 16
1.4 Product Label................................................................................................... 17
2 Product Concept ....................................................................................................... 18
2.1 Key Features at a Glance ................................................................................ 18
3 Getting Started with DGL61-W................................................................................. 21
3.1 Technical Requirements for Using DGL61-W.................................................. 21
3.2 Start Up the DGL61-W..................................................................................... 21
4 Interface Description ................................................................................................ 23
4.1 Overview .......................................................................................................... 23
4.2 Block Diagram.................................................................................................. 24
4.3 Operating Modes ............................................................................................. 25
4.4 USB Interface................................................................................................... 25
4.5 Power Supply................................................................................................... 26
4.6 Power Up/Power Down Scenarios................................................................... 26
4.6.1
Turn Device Gateway LTE on............................................................. 26
4.6.2 Reset/Restart Device Gateway LTE ................................................... 26
4.6.3 Turn Device Gateway LTE off............................................................. 26
4.6.4 Disconnecting power supply ............................................................... 27
4.7 Automatic thermal shutdown............................................................................ 27
4.8 RTC.................................................................................................................. 27
4.9 SIM Interface.................................................................................................... 28
4.10 Status LEDs ..................................................................................................... 29
5 Electrical and Environmental Characteristics........................................................ 30
5.1 Absolute Maximum Ratings ............................................................................. 30
5.2 Operating Power Supply .................................................................................. 30
5.3 RF Output Power ............................................................................................. 30
5.4 USB Interface................................................................................................... 31
5.5 Operating Temperatures.................................................................................. 32
5.6 Storage Conditions .......................................................................................... 33