Texas Instruments XTR108, Руководство пользователя

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Through-hole lead
makes contact to
pin socket with
spring action.
PIN DIA
0.36 - 0.56
[.014 - .022]
SPRING
EYELET
6.60
[.260]
2.54
[.100]
CONTACT PT
MIN
6.27
[.247] MAX PIN LENGTH
Hardware Setup
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16 SBOU123A – March 2012 – Revised September 2016
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XTR108EVM-USB Evaluation Board and Software Tutorial
2.3.3 Test Points and Miscellaneous Breadboard Area
There are multiple points available on the Sensor Board, including several connections to I
RET
. I
RET
is
common (labeled as GND on the board) for most XTR108 applications, and is provided for ease of
measuring analog signals. Reserved areas with plated-through, standard-spacing, 0.1-inch holes for
miscellaneous proof-of-concept breadboarding are also provided on the board. Most of the surface-mount
components have
pin sockets associated with them. These pin sockets allow the replacement of a
surface-mount component with a through-hole component.
The pin sockets provide good contact with the leads of a component without solder, thus enabling quick
reconfiguration of the board for many different XTR108 designs, as shown in
Figure 6 .
Figure 6. Pin Socket Mechanical Description
3 Hardware Setup
The XTR108EVM-USB hardware setup involves connecting the three EVM boards together, applying
power to the USB DAQ platform, connecting the USB cable, applying power to the Interface Board, and
setting the jumpers. This section covers the details of this procedure.
3.1 Electrostatic Discharge Warning
CAUTION
Many of the components on the XTR108EVM-USB are susceptible to damage
by electrostatic discharge (ESD). Customers are advised to observe proper
ESD handling precautions when unpacking and handling the EVM, including
the use of a grounded wrist strap at an approved ESD workstation.