Texas Instruments TPA032D02, Руководство пользователя

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TPA032D02 Class-D EVM Bill of Materials
3-26 Details
3.9 TPA032D02 Class-D EVM Bill of Materials
The components in the bill of materials (Table 3–5) were selected for their
common values, availability, and the smallest size available to meet these
criteria.
Table 3–5. TPA032D02 Class-D EVM Bill of Materials
Reference Description Size
EVM
Qty.
Manufacturer/
Part Number
C17 Capacitor, Ceramic Chip, 0.1
µ
F,
±
10%,
50 V, X7R
0805 1 Kemet
C0805C104J5RAC
C1, C2, C3, C4,
C8, C10
†
, C11,
C15, C16, C18
Capacitor, Ceramic Chip, 1
µ
F,
±
10%,
25 V, X7R
1206 10 Kemet
C1206C105K3RAC
C19 Capacitor, Ceramic Chip, 47 nF,
±
10%,
50 V, X7R
0805 1 Kemet
C0805V473K5RAC
C5, C6, C7 Capacitor, Ceramic Chip, 1 nF,
±
5%,
50 V, C0G,
0805 3 Kemet
C0805C102J5GAC
C9, C12 Capacitor, Ceramic Chip, 10
µ
F, +80%–20%,
25 V, Y5V
1210 2 muRata
GRM235Y5V106Z25
C13
†
, C14
†
Not assembled 0.492”
×
0.0236”
×
0.197”
2
C20, C21, C22,
C23 Capacitor, Ceramic Chip, 0.22
µ
F,
±
10%,
50 V, X7R
1206 4 Kemet
C1206C224K5RAC
C24, C25 Capacitor, Ceramic Chip, 1
µ
F,
±
10%,
50 V, X7R
1812 2 Kemet
C1812C105K5RAC
L1, L2, L3, L4 Inductor, SMT, 15
µ
H,
±
20%, 2.2 ADC, 47.2 m
Ω
@ 1 kHz, –20 to +90
°
C
0.398”
×
0.398”
×
0.236”
4 TDK
SLF10145T–150M2R2
R1, R2, R3, R4 Resistor, Thick Film Chip, SMD, 100 k
Ω
,
±
5%,
1/10 W, 100 V, –50 to 150
°
C,
±
200 ppm/
°
C
0603 4 Vishay/Dale
CRCW0603104J
R5 Resistor, Thick Film Chip, SMD, 500 k
Ω
,
±
5%,
1/16 W, 150 V, –50 to 150
°
C,
±
200 ppm/
°
C
0603 1 Vishay/Dale
CRCW0603500K
R6 Resistor, Thick Film Chip, SMD, 150 k
Ω
,
±
5%,
1/16 W, 150 V, –50 to 150
°
C,
±
200 ppm/
°
C
0603 1 Vishay/Dale
CRCW0603153J
Header Pins, Gold, Single, 0.5” Long, 0.25”
Wide, 0.100” centers 0.5”, 0.25”,
0.1”
16 Samtec
TSW–19–8–G–S
TP1 – TP4 Test Point, Red 4 Farnell
240–345
S1, S2 Switch, Momentary, Push Button, 12 VDC,
50 mA 0.291”
×
0.138”
×
0.134”
2 Panasonic
EVQ-PJS04K
U1 IC, Audio Amplifier, Class-D,
32 W, 48 pin, DCA pkg TSSOP48 1 TI
TPA032D02DCA
† Capacitors C13 and C14are optional (not assembled) and locations for them on the EVM PCB have been provided to increase
design flexibility and allow decoupling capacitance to be added (Section 3.7 Power Supply Decoupling).