General PowerPAD
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Design Considerations
1-17
General Information
Even though the THS7001 EVM PCB is different from the one in the example
above, the results should give an idea of how much power can be dissipated
by the PowerPAD IC package. The THS7001 EVM is a good example of proper
thermal management when using PowerPAD-mounted devices.
Correct PCB layout and manufacturing techniques are critical for achieving
adequate transfer of heat away from the PowerPAD IC package. More details
on proper board layout can be found in the
THS7001 Programmable-Gain
Amplifier data sheet (SLOS214). For more general information on the
PowerPAD package and its thermal characteristics, see the Texas
Instruments Technical Brief,
PowerPAD Thermally Enhanced Package
(SLMA002).
