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Mechanical Data
8.1
Thermal Data
8.2
Packaging Information
SM320C6455-EP
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS462B – SEPTEMBER 2007 – REVISED JANUARY 2008
Table 8-1
shows the thermal resistance characteristics for the PBGA - ZTZ/GTZ mechanical package.
Table 8-1. Thermal Resistance Characteristics (S-PBGA Package) [ZTZ/GTZ]
AIR FLOW
NO.
°
C/W
(m/s
(1)
)
1
R
Θ
JC
Junction-to-case
1.45
N/A
2
R
Θ
JB
Junction-to-board
8.34
N/A
3
16.1
0.00
4
13.0
1.0
R
Θ
JA
Junction-to-free air
5
11.9
2.0
6
10.7
3.0
0.37
0.00
0.89
1.0
7
Psi
JT
Junction-to-package top
1.01
1.5
1.17
3.00
7.6
0.00
6.7
1.0
8
Psi
JB
Junction-to-board
6.4
1.5
5.8
3.00
(1)
m/s = meters per second
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
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