MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.6
Thermal Characteristics
PARAMETER
VALUE
UNIT
LQFP (PN)
70
Low-K board (JESD51-3)
VQFN (RGC)
55
BGA (ZQE)
84
θ
JA
Junction-to-ambient thermal resistance, still air
°C/W
LQFP (PN)
45
High-K board (JESD51-7)
VQFN (RGC)
25
BGA (ZQE)
46
LQFP (PN)
12
θ
JC
Junction-to-case thermal resistance
VQFN (RGC)
12
°C/W
BGA (ZQE)
30
LQFP (PN)
22
θ
JB
Junction-to-board thermal resistance
VQFN (RGC)
6
°C/W
BGA (ZQE)
20
Copyright © 2009–2015, Texas Instruments Incorporated
Specifications
23
Submit Documentation Feedback
Product Folder Links:
MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Содержание MSP430F5527
Страница 123: ...D Max E Max 3 79 mm Min 3 79 mm Min 3 73 mm 3 73 mm ...
Страница 124: ......
Страница 125: ......
Страница 126: ......
Страница 127: ......