Texas Instruments MSP430F5527, Руководство пользователя

Страница: 19 / 128

MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5 Specifications
5.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Voltage applied at V
CC
to V
SS
–0.3 4.1 V
Voltage applied to any pin (excluding VCORE, VBUS, V18)
(2)
–0.3 V
CC
+ 0.3 V
Diode current at any device pin ±2 mA
Maximum operating junction temperature, T
J
95 °C
Storage temperature, T
stg
(3)
–55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to V
SS
. VCORE is for internal device use only. No external DC loading or voltage should be applied.
(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
5.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±1000
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±1000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
5.3 Recommended Operating Conditions
Typical values are specified at V
CC
= 3.3 V and T
A
= 25°C (unless otherwise noted)
MIN NOM MAX UNIT
PMMCOREVx = 0 1.8 3.6
PMMCOREVx = 0, 1 2.0 3.6
Supply voltage during program execution and flash
V
CC
V
programming (AV
CC
= DV
CC1/2
= DV
CC
)
(1) (2)
PMMCOREVx = 0, 1, 2 2.2 3.6
PMMCOREVx = 0, 1, 2, 3 2.4 3.6
PMMCOREVx = 0 1.8 3.6
PMMCOREVx = 0, 1 2.0 3.6
Supply voltage during USB operation, USB PLL disabled,
USB_EN = 1, UPLLEN = 0
PMMCOREVx = 0, 1, 2 2.2 3.6
V
CC, USB
V
PMMCOREVx = 0, 1, 2, 3 2.4 3.6
PMMCOREVx = 2 2.2 3.6
Supply voltage during USB operation, USB PLL enabled
(3)
,
USB_EN = 1, UPLLEN = 1
PMMCOREVx = 2, 3 2.4 3.6
V
SS
Supply voltage (AV
SS
= DV
SS1/2
= DV
SS
) 0 V
T
A
Operating free-air temperature I version –40 85 °C
T
J
Operating junction temperature I version –40 85 °C
C
VCORE
Recommended capacitor at VCORE
(4)
470 nF
C
DVCC
/
Capacitor ratio of DVCC to VCORE 10 ratio
C
VCORE
(1) TI recommends powering AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
(2) The minimum supply voltage is defined by the supervisor SVS levels when it is enabled. See the Section 5.22 threshold parameters for
the exact values and further details.
(3) USB operation with USB PLL enabled requires PMMCOREVx ≥ 2 for proper operation.
(4) A capacitor tolerance of ±20% or better is required.
Copyright © 2009–2015, Texas Instruments Incorporated
Specifications 19
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513