MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
1.3
Description
The TI MSP430™ family of ultra-low-power microcontrollers consists of several devices featuring
peripheral sets targeted for a variety of applications. The architecture, combined with extensive low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The
microcontroller features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that
contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the devices to wake
up from low-power modes to active mode in 3.5 µs (typical).
The MSP430F5529, MSP430F5527, MSP430F5525, and MSP430F5521 microcontrollers have integrated
USB and PHY supporting USB 2.0, four 16-bit timers, a high-performance 12-bit analog-to-digital
converter (ADC), two universal serial communication interfaces (USCI), a hardware multiplier, DMA, a
real-time clock (RTC) module with alarm capabilities, and 63 I/O pins. The MSP430F5528,
MSP430F5526, MSP430F5524, and MSP430F5522 microcontrollers include all of these peripherals but
have 47 I/O pins.
The MSP430F5519, MSP430F5517, and MSP430F5515 microcontrollers have integrated USB and PHY
supporting USB 2.0, four 16-bit timers, two universal serial communication interfaces (USCI), a hardware
multiplier, DMA, an RTC module with alarm capabilities, and 63 I/O pins. The MSP430F5514 and
MSP430FF5513 microcontrollers include all of these peripherals but have 47 I/O pins.
Typical applications include analog and digital sensor systems, data loggers, and others that require
connectivity to various USB hosts.
Device Information
(1)
PART NUMBER
PACKAGE
BODY SIZE
(2)
MSP430F5529PN
LQFP (80)
12 mm × 12 mm
MSP430F5528RGC
VQFN (64)
9 mm × 9 mm
MSP430F5528YFF
DSBGA (64)
3.5 mm × 3.5 mm
MSP430F5528ZQE
MicroStar Junior™ BGA (80)
5 mm × 5 mm
(1)
For the most current part, package, and ordering information for all available devices, see the
Package Option Addendum
in
Section 8
,
or see the TI website at
www.ti.com
.
(2)
The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data
in
Section 8
.
2
Device Overview
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MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Содержание MSP430F5527
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