E-1
Appendix E
TI to IAR 2.x/3.x Assembler Migration
Texas Instruments made a suite of development tools for the MSP430,
including a comprehensive assembler and device simulator. The source of
the TI assembler and the source of the Kickstart assembler are not 100%
compatible; the instruction mnemonics are identical, while the assembler
directives are somewhat different. The following section documents the
differences between the TI assembler directives and the Kickstart 2.x/3.x
assembler directives.
Topic Page
E.1 Segment Control
E-2
E.2 Translating Asm430 Assembler Directives to A430 Directives
E-2
E.2.1 Introduction
E-2
E.2.2 Character strings
E-2
E.2.3 Section Control Directives
E-3
E.2.4 Constant Initialization Directives
E-4
E.2.5 Listing Control Directives
E-4
E.2.6 File Reference Directives
E-5
E.2.7 Conditional-Assembly Directives
E-5
E.2.8 Symbol Control Directives
E-6
E.2.9 Macro Directives
E-7
E.2.10 Miscellaneous Directives
E-7
E.2.11 Preprocessor Directives
E-7
E.2.12 Alphabetical Listing and Cross Reference of Asm430
Directives
E-8
E.2.13 Additional A430 Directives (IAR)
E-8
Содержание MSP-FET430
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Страница 4: ...July 2004 U s e r s G u i d e ...
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Страница 52: ...Hardware B 2 Figure B 1 MSP FET430X110 Schematic ...
Страница 54: ...Hardware B 4 Figure B 3 MSP FET430IF FET Interface module Schematic ...
Страница 55: ...Hardware B 5 Figure B 4 MSP FET430IF FET Interface module PCB Pictorial R6 Ensure value is 82 ohms ...
Страница 63: ...Hardware B 13 Figure B 11 MSP TSPN80 Target Socket module Schematic ...
Страница 67: ...Hardware B 17 Figure B 15 MSP FET430UIF USB Interface schematics ...
Страница 68: ...Hardware B 18 ...
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Страница 95: ...MSP FET430UIF Installation Guide F 5 Figure F 5 Device Manager ...