Texas Instruments bq77915EVM-014, Руководство пользователя

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Additional Evaluation Setups
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8 SLUUBU2B – March 2018 – Revised August 2018
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bq77915 3-5S Low Power Protector Evaluation Module
3.4 Stacking Modules
While the bq77915 EVM modules do not stack as delivered, they can be modified for a basic
demonstration of stacking by adding additional components. The resulting circuit is not ideal because the
ESD capacitors will remain across each module rather than across the pack terminals. The charge and
discharge FETs installed are 60-V rated and will normally accommodate connection of two EVMs.
Connection of more than two EVMs is not supported by the patterns on the board and is not
recommended. Before connecting the modules, the bottom and top modules must have component
additions and changes shown in
Table 2 to enable the stacking inputs and support the UV load removal
recovery detection for the upper device. Next, connect the upper board J7 to the lower board J1. Also
connect the upper board J5 pins 1 and 3 to the lower board J4 pins 1 and 3, respectively. The top board
must also have a wire connecting the BATT- pin on J2 to the PACK- pin on J9. A connection example of
the two modules is shown in
Figure 5 .
Table 2. Module Modifications for Stacking
Module Reference Designator Action Function
Bottom
R2 Install 10-M Ω resistor
Stacking interface
R3 Install 10-M Ω resistor
R7 Remove
R8 Remove
R12 Install 10-k Ω resistor
J4 Remove shunt
R32 Install 470-k Ω resistor
UV load detect recovery
D3 Install BAS16J switching diode
Top
R18 Install 10-k
Ω
resistor
Stacking interface J5 Remove shunt
J6 Move shunt to pins 15 and 16