Teridian 73S8009C Скачать руководство пользователя страница 12

73S8009C Demo Board User Manual 

UM_8009C_059

 

 

12 

 

Rev. 1.3 

4  Design Considerations 

4.1 

General Layout Rules 

Follow these layout rules: 

 

 

Route I/O and auxiliary signals away from card interface signals. 

 

Keep CLK trace as short as possible and with minimal bends in the trace.  If possible, keep routing of 
the CLK trace to one layer (avoid vias to other layers).  Keep CLK trace away from other traces 
especially RST, I/O and VCC.  Filtering of the CLK trace is allowed for noise purposes.  Up to 30 pF 
to ground is allowed at the CLK pin of the smart card connector.  Also, the zero 

Ω

 series resistor (R7) 

can be replaced with a small resistor for additional filtering (no more than 100 

Ω

). 

 

Keep VCC trace as short as possible.  Make trace a minimum of 0.5 mm thick.  Also, keep VCC away 
from other traces especially RST and CLK. 

 

Keep RST trace away from VCC and CLK traces.  Up to 30 pF to ground is allowed for filtering. 

 

Keep 0.1 

µ

F close to VDD pin of the device and directly take other end to ground. 

 

Keep 0.1 

µ

F and 10 

µ

F close to VPC pin of the device and directly take other end to ground. 

 

Keep 4.7 

µ

F close to VP pin of the device and directly take other end to ground. 

 

Keep 0.47 

µ

F close to VCC pin of the smart card connector and directly take other end to ground. 

 

4.2 

Optimization for Compliance with EMV 

Default configuration of the Demo board contains a 27 pF capacitor (C12) from the CLK pin of the smart 
connector to ground and a 27 pF capacitor (C13) from the RST pin of the smart connector to ground.  
These capacitors serve as filters for CLK and RST signals in the case of long traces or test equipment 
perturbations.  The capacitor on CLK reduces ringing on the trace, reduces coupling to other traces and 
slows down the edge of the CLK signal.  The capacitor on RST helps the perturbation specification in a 
noisy environment. The filter capacitors can be useful in the EMV test environment and have no effect on 
NDS testing 
 
C12 and C13 are represented on both schematic and BOM.  These capacitors are optional filter 
capacitors on the smart card lines CLK and RST, respectively for each card interface. These capacitors 
may be adjusted (value, not to exceed 30 pF) or removed to optimize performance in each specific 
application (PCB, card clock frequency, compliance with applicable standards etc). 
 

4.3 

Power Supply Input Configurations 

4.3.1  USB Power 

The USB configuration uses the power supplied by the VBUS (4.4 to 5.5 V) and an optional VBAT input 
that automatically switches from the VBUS to VBAT when the VBUS power is removed.  This switch over 
is done smoothly and does not cause any disruption of the operation of the 73S8009C and the VDD 
output supply.  The operation of the ON/OFF switch is overridden when VBUS is applied.  The 73S8009C 
and VDD output will always be active while the VBUS voltage is applied.  The ON/OFF switch is enabled 
when running off VBAT.  When using this configuration, the VPC input should not be connected to any 
other power source. 
 

4.3.2  Single Supply Power 

The single supply configuration should leave the VBUS and VBAT pins unconnected and only connect 
the power supply to VPC (2.7 to 6.0 V). 
 
 

Содержание 73S8009C

Страница 1: ...Simplifying System IntegrationTM 73S8009C Demo Board User Manual February 10 2010 Rev 1 3 UM_8009C_059...

Страница 2: ...the Company s warranty detailed in the Teridian Semiconductor Corporation standard Terms and Conditions The company assumes no responsibility for any errors which may appear in this document reserves...

Страница 3: ...t Points 9 4 Design Considerations 12 4 1 General Layout Rules 12 4 2 Optimization for Compliance with EMV 12 4 3 Power Supply Input Configurations 12 4 3 1 USB Power 12 4 3 2 Single Supply Power 12 4...

Страница 4: ...ew 15 Figure 7 73S8009C Demo Board Top Signal Layer 16 Figure 8 73S8009C Demo Board Middle Layer 1 Ground Plane 16 Figure 9 73S8009C Demo Board Middle Layer 2 Supply Plane 17 Figure 10 73S8009C Demo B...

Страница 5: ...e used in conjunction with the 73S12xxF evaluation platform 1 1 Package Contents Figure 1 73S8009C Demo Board The 73S8009C Demo Board Kit includes A 73S8009C Demo Board Rev 1 The following documents 7...

Страница 6: ...oltage card interface 0 3 to VCC 0 3 VDC Pin Voltage LIN pin 0 3 to 6 5 VDC ESD Tolerance Card interface pins 6 kV ESD Tolerance Other pins 2 kV Pin Current 200 mA Operation outside these rating limit...

Страница 7: ...ound pin Pin 9 Table 3 J4 Pin Descriptions Pin Pin Name Function 1 CMDVCC Controls the turn on output voltage value and turn off of VCC 2 CMDVCC 3 RSTIN Controls the card reset signal 4 RDY Indicates...

Страница 8: ...8 to from the card 5 OFF Interrupt signal to the processor Indicator of card presence and any card fault conditions 6 GND Ground 7 GND Ground 8 GND Ground 9 VPC IN Must be between 2 7 V and 6 5 V 10 V...

Страница 9: ...UM_8009C_059 73S8009C Demo Board User Manual Rev 1 3 9 3 Jumpers Switches and Test Points The items marked in Figure 3 are described in Table 5 Figure 3 73S8009C Demo Board Description...

Страница 10: ...t VBUS Test point C4 CLK RST VCC I O C8 VBAT Input VBUS Input Two pin test points for each respective smart card signal The pin label name is the respective signal i e VCC CLK and the other pin is GND...

Страница 11: ...ee board errata in the appendix for JP6 16 J5 Smart Card Connector Smart card connector When inserting a card credit card size format contacts must face up 17 JP7 CS Disable CS Disable Jumper Insertio...

Страница 12: ...the smart connector to ground These capacitors serve as filters for CLK and RST signals in the case of long traces or test equipment perturbations The capacitor on CLK reduces ringing on the trace re...

Страница 13: ...hed it can set the OFF_ACK signal high to shut off the 73S8009C If there is no need for the host to perform any shutdown tasks the OFF_ACK pin can be left open and it follows the state of the OFF_REQ...

Страница 14: ...C3 OFF_REQ CS C4 4 7uF 1 2 3 JP6 1 2 3 JP5 1 2 TP5 1 2 3 JP3 1 2 TP7 1 2 TP8 1 2 TP4 1 2 TP6 1 2 JP4 3 3V Note JP4 pins 1 and 2 must not be connected with JP2 pins 1 and 2 at the same time GND C8 DNI...

Страница 15: ...UM_8009C_059 73S8009C Demo Board User Manual Rev 1 3 15 5 2 73S8009C PCB Layouts Figure 5 73S8009C Demo Board Top View Figure 6 73S8009C Demo Board Bottom View...

Страница 16: ...73S8009C Demo Board User Manual UM_8009C_059 16 Rev 1 3 Figure 7 73S8009C Demo Board Top Signal Layer Figure 8 73S8009C Demo Board Middle Layer 1 Ground Plane...

Страница 17: ...UM_8009C_059 73S8009C Demo Board User Manual Rev 1 3 17 Figure 9 73S8009C Demo Board Middle Layer 2 Supply Plane Figure 10 73S8009C Demo Board Bottom Signal Layer...

Страница 18: ...10_L_SV SSM_110_L_SV X SSM_110_L_SV Samtec 2 J2 J4 TSM_110_01_L_SV TSM_110_01_L_SV X TSM_110_01_L_SV Samtec 1 J5 Smart Card Connector ITT_CCM02 2504 401 1715 ND CCM02 2504LFT ITTCannon 1 J6 SIM SAM Co...

Страница 19: ...ation The following 73S8009C documents are available from Teridian Semiconductor Corporation 73S8009C Data Sheet 73S8009C Demo Board User Manual 9 Contact Information For more information about Teridi...

Страница 20: ...ected pin number for OFF_ACK in pin description 1 3 2 10 2010 Formatted in the new Teridian style Added Section 1 1 Package Contents Added Section 1 2 Safety and ESD Notes Added Table 3 J4 Pin Descrip...

Страница 21: ...Mouser Electronics Authorized Distributor Click to View Pricing Inventory Delivery Lifecycle Information Maxim Integrated 73S8009C DB...

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