b.
Check the reading in the “ACT” column. If this number is less than 300 the
crystal needs to be replaced. Your trainer will instruct you on how to change the
crystal.
c.
To exit the “Sensors” screen, press the “Operate” button.
2.
Select your process:
a.
Press “Process Directory”.
b.
Using the arrow keys, cursor to the desired material. Select the material by
pressing “Select Active Process”.
3.
Set the final thickness and deposition rate:
a.
From the Process Directory Screen, press “Process”.
b.
Set the deposition rate.
The deposition rate should not be set above 5Å/s for
any material and for Aluminum it should not be set above 3 Å/s.
c.
Set the final thickness.
d.
Make sure that the thickness limit and time limit are set sufficiently high so that
the deposition will not time out before you reach your desired thickness.
e.
DO NOT CHANGE ANY OTHER SETTINGS ANY WHERE IN THE I/C5
CONTROLLER!!!
f.
Press the F6 button until you reach the main screen.
4.
Please note that if you need to deposit more than one layer each layer must be
programmed independently. The IC/5 does not control the turret source selector.
If
you have already deposited a layer and plan to deposit another, proceed to step 5
of the “Deposition” section of this operation procedure.
Deposition:
1.
Once the chamber pressure is at or below 1.0e-6 you may begin the deposition.
2.
Turn on the “Main Power” switch on the power supply.
3.
Turn the interlock key on the control panel to the on position.
4.
Press the “HV On” button to turn the high voltage on.
5.
Make sure the turret dial is set to the metal you intend to evaporate.
6.
Press “Gun 1 Fil On” button to turn on the filament.
7.
Press the “Start” button on the IC/5 Deposition Controller. The deposition is
completely automatic. The system will go through a series of filament power ramp
and soak times before reaching deposition.
8.
During Soak One check to make sure that the beam is sweeping properly.
Go to the
“Beam Position and Sweep Settings” segment of this operation procedure.
After
the beam sweep is set correctly set the shutter control back to “Auto”.
9.
The shutter will open after the second soak time and the IC/5 will adjust the power
setting to maintain the deposition rate set by the user.
10.
During the deposition, record the power, deposition rate and process vacuum on the
log sheet.
11.
When the final thickness is reached the shutter will close and the filament current will
automatically ramp down.
12.
When the power reaches 0%, press the “Gun 1 Fil Off” button to turn off the filament.
13.
If you need to deposit another layer at this point, return to step 2 of the “IC/5
Deposition Controller” section of this operation procedure.
14.
Press the “HV Off” button to turn off the high voltage.
