xE70-915 RF Module User Guide
1VV0301106
rev.3 – 2015-03-04
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved.
Page 23 of 34
5.2.
Storage
The optimal storage environment for xE70-915 modules should be dust free, dry and the
temperature should be included between -40°C and +85°C.
In case of a reflow soldering process, radio modules must be submitted to a drying bake at
+125°C during 24 hours. The drying bake must be used prior to the reflow soldering process
in order to prevent a popcorn effect. After being submitted to the drying bake, modules must
be soldered on host boards within 168 hours.
Also, it must be noted that due to some components, xE70-915 modules are ESD sensitive
device. Therefore, ESD handling precautions should be carefully observed.
5.3.
Soldering pad pattern
The surface finished on the printed circuit board pads should be made of Nickel/Gold surface.
The recommended soldering pad layout on the host board for the xE70-915 module is shown
in the diagram below:
All dimensions in mm
Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the
module.
