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UE866 HARDWARE USER GUIDE

1vv0301157 Rev.12

•

2017-02-10

58 of 70

9.2

PCB pad design

Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

9.3

PCB pad dimensions

The recommendation for the PCB pads dimensions are described in the following image (dimensions

in mm)

Solder resist openings

PCB

Copper Pad

Solder Mask

SMD

(Solder Mask Defined)

NSMD

(Non Solder Mask Defined)

Содержание UE866-EU

Страница 1: ...UE866 HARDWARE USER GUIDE 1vv0301157 Rev 12 2017 02 10 1 of 70 Reproduction forbidden without Telit Communications PLC written authorization All Rights Reserved UE866 HARDWARE USER GUIDE ...

Страница 2: ...66 HARDWARE USER GUIDE 1vv0301157 Rev 12 2017 02 10 2 of 70 Reproduction forbidden without Telit Communications PLC written authorization All Rights Reserved APPLICABILITY TABLE PRODUCTS UE866 N3G UE866 EU ...

Страница 3: ...y rights in and to the Specifications and the products and services contained herein is owned exclusively by Telit and its licensors Other than as expressly set forth herein no license or other rights in or to the Specifications and intellectual property rights related thereto are granted to you Nothing in these Specifications shall or shall be deemed to convey license or any other right under Tel...

Страница 4: ...include Third Party Right software In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software In addition to Third Party Terms the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES R...

Страница 5: ...Supply 17 4 1 Power Supply Requirements 17 4 2 Power Consumption 18 4 3 General Design Rules 19 Electrical Design Guidelines 19 5V Source Power Supply Design Guidelines 19 12V input Source Power Supply Design Guidelines 20 Battery Source Power Supply Design Guidelines 21 Thermal Design Guidelines 22 Power Supply PCB layout Guidelines 23 4 4 RTC Bypass out 24 4 5 VAUX Power Output 24 5 Digital Sect...

Страница 6: ...er 44 Enabling DAC 44 LOW Pass filter Example 45 6 RF Section 46 6 1 Bands Variants 46 6 2 TX Output Power 46 6 3 RX Sensitivity 47 6 4 Antenna Requirements 48 PCB design guidelines 48 PCB Guidelines in case of FCC Certification 50 Transmission line design 50 Transmission Line Measurements 51 Antenna Installation Guidelines 54 7 Audio Section 55 7 1 Overview 55 7 2 Digital Voice Interface 55 CODEC...

Страница 7: ...017 02 10 7 of 70 Reproduction forbidden without Telit Communications PLC written authorization All Rights Reserved 10 2 Moisture sensitivity 64 11 SAFETY RECOMMANDATIONS 65 12 FCC IC Regulatory notices 66 13 Document History 69 13 1 Revisions 69 ...

Страница 8: ...ications using our UE866 modules 1 3 Contact Information Support For general contact technical support services technical questions and report documentation errors contact Telit Technical Support at TS EMEA telit com TS AMERICAS telit com TS APAC telit com Alternatively use http www telit com support For detailed information about where you can buy the Telit modules or for recommendations on acces...

Страница 9: ...nlink Packet Access HSUPA High Speed Uplink Packet Access UART Universal Asynchronous Receiver Transmitter HSIC High Speed Inter Chip SIM Subscriber Identification Module SPI Serial Peripheral Interface ADC Analog Digital Converter DAC Digital Analog Converter I O Input Output GPIO General Purpose Input Output CMOS Complementary Metal Oxide Semiconductor MOSI Master Output Slave Input MISO Master ...

Страница 10: ...er to important points about integrating the module if these points are not followed the module and end user equipment may fail or malfunction Tip or Information Provides advice and suggestions that may be useful when integrating the module All dates are in ISO 8601 format i e YYYY MM DD 1 6 Related Documents Digital Voice Interface Application Note 80000NT10050A SPI Port Application Note 80000NT1...

Страница 11: ...ion of the WCDMA UE866 cellular module within user application shall be done according to the design rules described in this manual IT L integrazione del modulo cellulare WCDMA UE866 all interno dell applicazione dell utente dovrà rispettare le indicazioni progettuali descritte in questo manuale DE Die Integration des UE866 WCDMA Mobilfunk Moduls in ein Gerät muß gemäß der in diesem Dokument besch...

Страница 12: ...CMOS 1 8V A2 C108 DTR I Input for Data terminal ready signal DTR from DTE CMOS 1 8V A1 C105 RTS I Input for Request to send signal RTS from DTE CMOS 1 8V B1 C106 CTS O Output for Clear to send signal CTS to DTE CMOS 1 8V A4 C103 TXD I Serial data input TXD from DTE CMOS 1 8V A5 C104 RXD O Serial data output to DTE CMOS 1 8V Asynchronous Auxiliary Serial Port USIF1 C2 RXD_AUX SPI_MISO I O Auxiliary...

Страница 13: ...rable GPIO STATLED CMOS 1 8V Alternate Function STAT LED F11 SPI_CLK I O SPI_CLK CMOS 1 8V E11 SPI_SRDY I O SPI_SRDY CMOS 1 8V D11 SPI_MRDY I O SPI_MRDY CMOS 1 8V ADC and DAC F4 ADC_IN1 AI Analog Digital converter input A D Accepted values 0 to 1 2V DC E4 DAC_OUT AO Digital Analog converter output D A RF SECTION G2 Antenna I O Antenna pad 50 Ω RF Miscellaneous Functions F5 VRTC AO backup for the e...

Страница 14: ...ED RESERVED D7 RESERVED RESERVED E7 RESERVED RESERVED F7 RESERVED RESERVED G7 RESERVED RESERVED B8 RESERVED RESERVED C8 RESERVED RESERVED D8 RESERVED RESERVED E8 RESERVED RESERVED F8 RESERVED RESERVED A9 RESERVED RESERVED B9 RESERVED RESERVED C9 RESERVED RESERVED D9 RESERVED RESERVED E9 RESERVED RESERVED F9 RESERVED RESERVED G9 RESERVED RESERVED A10 RESERVED RESERVED B10 RESERVED RESERVED C10 RESE...

Страница 15: ...ould be connected to a Test Point B1 C106 CTS If not used should be connected to a Test Point G6 VAUX PWRMON G4 RESET C1 TXD_AUX If not used should be connected to a Test Point C2 RXD_AUX If not used should be connected to a Test Point E5 USB D If not used should be connected to a Test Point or an USB connector E6 USB D If not used should be connected to a Test Point or an USB connector D4 USB_VBU...

Страница 16: ...D ANT 3 C107 DSR C125 RING GND RFU GND GND GND 4 C103 TXD GPIO_06 GPIO_07 USB_VBUS DAC_OUT ADC_IN1 RESET 5 C104 RXD GPIO_05 GPIO_01 GPIO_04 USB_D VRTC RESERVED 6 SIMIO RESERVED GPIO_02 GPIO_03 USB_D GND VAUX PWR MON 7 SIMCLK SIMRST SIMVCC RESERVED RESERVED RESERVED RESERVED 8 GND RESERVED RFU RFU RFU RFU GND 9 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED 10 RESERVED RESERVED RESE...

Страница 17: ...lowing requirements Power Supply Value Nominal Supply Voltage 3 8V Normal Operating Voltage Range 3 40 V 4 20 V Extended Operating Voltage Range 3 10 V 4 50 V NOTE The Operating Voltage Range MUST never be exceeded care must be taken when designing the application s power supply section to avoid having an excessive voltage drop If the voltage drop is exceeding the limits it could cause a Power Off...

Страница 18: ... 2 Full functionality with power saving DRX9 1 3mA in case of DRX5 Operative mode GSM CSD TX and RX Mode GSM Voice Call GSM 850 900 CSD PL5 220 DCS1800 PCS1900 CSD PL0 167 GPRS 4TX 1RX GPRS Sending Data Mode GSM 850 900 PL5 580 DCS1800 PCS1900 PL0 438 Idle mode WCDMA AT CFUN 1 19 Normal mode full functionality of the module AT CFUN 5 1 6 mA Disabled TX and RX DRX7 Operative mode WCDMA WCDMA Voice ...

Страница 19: ...n Guidelines The desired output for the power supply is 3 8V hence there s not a big difference between the input source and the desired output and a linear regulator can be used A switching power supply will not be suited because of the low drop out requirements When using a linear regulator a proper heat sink shall be provided in order to dissipate the power generated A Bypass low ESR capacitor ...

Страница 20: ...y and Switching design selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences For car PB battery the input voltage can rise up to 15 8V and this should be kept in mind when choosing components all components in the power supply must withstand this voltage A Bypass low ESR capacitor of adequate capacity must be provided ...

Страница 21: ...r usually a tantalum one is rated at least 10V A protection diode should be inserted close to the power input in order to save the UE866 from power polarity inversion Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A the suggested capacity is fro...

Страница 22: ... hour then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated one for 700mA maximum RMS current or even could be the simple chip package no heat sink Moreover in the average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than the 700...

Страница 23: ...hen an 1A current peak is absorbed The PCB traces to the UE866 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur This is for the same reason as previous point Try to keep this trace as short as possible To reduce the EMI due to switching it is important to keep very small the mesh involved thus the input capacitor the output diode if not embodied in the IC a...

Страница 24: ...o the related VRTC signal pad F5 on module s Pinout For additional details on the Backup solutions please refer to the related application note RTC Backup Application Note 4 5 VAUX Power Output A regulated power supply output is provided in order to supply small devices from the module The signal is present on Pad G6 and it is in common with the PWRMON module powered ON indication function This ou...

Страница 25: ...Levels Specification ABSOLUTE MAXIMUM RATINGS NOT FUNCTIONAL OPERATING RANGE INTERFACE LEVELS 1 8V CMOS Parameter Min Max Input high level 1 5V 1 9V Input low level 0V 0 35V Output high level 1 6V 1 9V Output low level 0V 0 2V CURRENT CHARACTERISTICS Parameter AVG Output Current 1mA Input Current 1uA Parameter Min Max Input level on any digital pin CMOS 1 8 with respect to ground 0 3V 2 1V ...

Страница 26: ...le can be considered fully operating after 5 seconds The following flow chart shows the proper turn on procedure NOTE The power supply must be applied either at the same time on pins VBATT and VBATT_PA To guarantee a correct module s start up please check that the Power Supply is with a level 3 22V within 21mS PWRMON ON Modem ON Proc START PWR Supply ON 3 22V PWRMON ON Delay 300 ms AT Init Sequenc...

Страница 27: ...AT commands managing procedure is displayed below NOTE In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the UE866 when the module is powered off or during an ON OFF transition Start AT CMD START Delay 300 msec Enter AT CR Disconnect PWR Supply AT answer in 1 sec GO TO Modem ON Proc Start AT CMD END Y N ...

Страница 28: ...eserved WARNING It is recommended to power on the module only after VBATT is higher than 3 22V The maximum rump up time for VBATT is 21mS In case this condition it is not satisfied you could use the HW_SHUTDOWN line to recover it An example of this is described in the following diagram After RESET is released the module will automatically power on itself ...

Страница 29: ...5 3 Power off The following flowchart shows the proper Turn off procedure In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the UE866 when the module is powered off or during an ON OFF transition Modem OFF Proc AT SYSHALT 10s Timeout Disconnect PWR Supply Modem ON Proc Delay 1 5s ...

Страница 30: ...use any pull up resistor on the RESET line nor any totem pole digital output Using pull up resistor may bring to latch up problems on the UE866 power regulator and improper functioning of the module The line RESET must be connected only in open collector configuration the transistor must be connected as close as possible to the RESET pin The unconditional hardware restart must always be implemente...

Страница 31: ...mmunications PLC written authorization All Rights Reserved A typical circuit is the following NOTE In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the UE866 when the module is powered off or during an ON OFF transition ...

Страница 32: ...r on the HW_SHUTDOWN line nor any totem pole digital output Using pull up resistor may bring to latch up problems on the UE866 power regulator and improper functioning of the module To proper power on again the module please refer to the related paragraph Power ON The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure Mod...

Страница 33: ...rential Data 3 3V E6 USB_D I O USB differential Data 3 3V D4 VUSB AI Power sense for the internal USB transceiver 5V Accepted range 4 4V to 5 25V The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz The signal traces should be routed carefully Trace lengths number of vias and capacitive loading should be minimized The characteristic impedance value should be as close as possible to 90...

Страница 34: ...nd MRDY master ready The AP has the master role that is it supplies the clock The following table is listing the available signals PAD Signal I O Function Type NOTE C1 SPI_MOSI I SPI MOSI CMOS 1 8V Shared with TX_AUX C2 SPI_MISO O SPI MISO CMOS 1 8V Shared with RX_AUX F11 SPI_CLK I SPI Clock CMOS 1 8V D11 SPI_MRDY I SPI_MRDY CMOS 1 8V E11 SPI_SRDY O SPI_SRDY CMOS 1 8V NOTE Due to the shared functi...

Страница 35: ...66 is a 1 8V UART with all the 7 RS232 signals It differs from the PC RS232 in the signal polarity RS232 is reversed and levels The following table is listing the available signals RS232 Pin Signal Pad Name Usage 1 C109 DCD B2 Data Carrier Detect Output from the UE866 that indicates the carrier presence 2 C104 RXD A5 Transmit line see Note Output transmit line of UE866 UART 3 C103 TXD A4 Receive l...

Страница 36: ...e below NOTE According to V 24 some signal names are referred to the application side therefore on the UE866 side these signal are on the opposite direction TXD on the application side will be connected to the receive line here named C103 TXD RXD on the application side will be connected to the transmit line here named C104 RXD For a minimum implementation only the TXD RXD lines can be connected t...

Страница 37: ...l port are PAD Signal I O Function Type NOTE C1 TX_AUX O Auxiliary UART TX Data to DTE CMOS 1 8V Shared with SPI_MOSI C2 RX_AUX I Auxiliary UART RX Data from DTE CMOS 1 8V Shared with SPI_MISO NOTE Due to the shared pins when the Modem Serial port is used it is not possible to use the SPI functions In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level sign...

Страница 38: ... of level translation is always required The simplest way to translate the levels and invert the signal is by using a single chip level translator There are a multitude of them differing in the number of drivers and receivers and in the levels be sure to get a true RS232 level translator not a RS485 or other standards By convention the driver is the level translator from the 0 1 8V UART to the RS2...

Страница 39: ... the available GPIO on the UE866 PAD Signal I O Drive Strength Default State NOTE C5 GPIO_01 I O 1 mA INPUT Alternate function Digital Audio Interface WA0 C6 GPIO_02 I O 1 mA INPUT Alternate functions Jammer Detect Report Digital Audio Interface RX D6 GPIO_03 I O 1 mA INPUT Alternate function Digital Audio Interface TX D5 GPIO_04 I O 1 mA INPUT Alternate function TX Disable Digital Audio Interface...

Страница 40: ...s can be connected to a digital output of another device and report its status provided this device has interface levels compatible with the 1 8V CMOS levels of the GPIO If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 1 8V CMOS then it can be buffered with an open collector transistor with a 47K pull up to 1 8V NOTE In order to av...

Страница 41: ...be enabled using the AT GPIO 7 0 2 command In the UE866 modules the STAT_LED needs an external transistor to drive an external LED Therefore the status indicated in the following table is reversed with respect to the pin status Device Status Led Status Device off Permanently off Not Registered Permanently on Registered in idle Blinking 1sec on 2 sec off Registered in idle power saving It depends o...

Страница 42: ...TECT input The AT Command used to enable the function is AT SIMINCFG Use the AT command AT SIMDET 2 to enable the SIMIN detection Use the AT command AT W0 and AT P0 to store the SIMIN detection in the common profile NOTE Don t use the SIM IN function on the same pin where the GPIO function is enabled and vice versa 5 7 External SIM Holder Please refer to the related User Guide SIM Holder Design Gu...

Страница 43: ...ADC pin input store and convert it into 10 bit word The input line is named as ADC_IN1 and it is available on Pad F4 The following table is showing the ADC characteristics Item Min Typical Max Unit Input Voltage range 0 1 2 Volt AD conversion 10 bits Input Resistance 1 Mohm Input Capacitance 1 pF The ADC could be controlled using an AT command The command is AT ADC 1 2 The read value is expressed ...

Страница 44: ... Voltage range filtered 0 1 8 Volt Range 0 1023 Steps The precision is 10 bits so if we consider that the maximum voltage is 2V the integrated voltage could be calculated with the following formula Integrated output voltage 2 value 1023 DAC_OUT line must be integrated for example with a low band pass filter in order to obtain an analog voltage Enabling DAC An AT command is available to use the DAC...

Страница 45: ...UE866 HARDWARE USER GUIDE 1vv0301157 Rev 12 2017 02 10 45 of 70 Reproduction forbidden without Telit Communications PLC written authorization All Rights Reserved LOW Pass filter Example ...

Страница 46: ...ights Reserved 6 RF SECTION 6 1 Bands Variants The following table is listing the supported Bands 6 2 TX Output Power Product Supported 2G bands UE866 N3G UE866 EU GSM900 DCS1800 Product Supported 3G bands UE866 N3G FDD B2 B5 UE866 EU FDD B1 B8 Band Power Class GSM 900 Class 4 2W DCS 1800 Class 1 15W FDD B1 B8 Class 3 0 25W FDD B2 B5 Class 3 0 25W ...

Страница 47: ...301157 Rev 12 2017 02 10 47 of 70 Reproduction forbidden without Telit Communications PLC written authorization All Rights Reserved 6 3 RX Sensitivity Band Sensitivity GSM 900 109dBm DCS 1800 110dBm FDD B1 B8 111dBm FDD B2 B5 110dBm ...

Страница 48: ...e antenna must be connected to the UE866 antenna pad by means of a transmission line implemented on the PCB In the case the antenna is not directly connected at the antenna pad of the UE866 then a PCB line is needed in order to connect with it or with its connector This transmission line shall fulfil the following requirements Item Value Frequency range Depending by frequency band s provided by th...

Страница 49: ...rack The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by placing vias every 2mm at least Place EM noisy devices as far as possible from UE866 antenna line Keep the antenna line far away from the UE866 power supply lines If you have EM noisy devices around the PCB hosting the UE866 such as fast switching ICs take care of the shielding of the antenna line by...

Страница 50: ...acement of components has been chosen properly in order to keep the line length as short as possible thus leading to lowest power losses possible A Grounded Coplanar Waveguide G CPW line has been chosen since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case A SMA female connector has been used to feed the line The int...

Страница 51: ... Transmission Line Measurements An HP8753E VNA Full 2 port calibration has been used in this measurement session A calibrated coaxial cable has been soldered at the pad corresponding to RF output a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself During Return Loss impedance measurements the transmission line h...

Страница 52: ...ion forbidden without Telit Communications PLC written authorization All Rights Reserved Line input impedance in Smith Chart format once the line has been terminated to 50 Ω load is shown in the following figure Insertion Loss of G CPW line plus SMA connector is shown below ...

Страница 54: ...arther than 20cm from the human body and there are no co located transmitter then the Telit FCC IC approvals can be re used by the end product If the device antenna is located closer than 20cm from the human body or there are co located transmitter then the additional FCC IC testing may be required for the end product Telit FCC IC approvals cannot be reused Antenna shall not be installed inside me...

Страница 55: ... 2 Digital Voice Interface The UE866 Module is provided by one DVI digital voice interface The Signals are available on the following Pads and alternate function of the GPIOs PAD Signal I O Function C5 DVI_WA0 I O Digital Voice Interface Word Alignment LRCLK C6 DVI_RX I Digital Voice Interface RX D6 DVI_TX O Digital Voice Interface TX D5 DVI_CLK I O Digital Voice Interface BCLK CODEC Examples Plea...

Страница 56: ...authorization All Rights Reserved 8 MECHANICAL DESIGN 8 1 Drawing In case of UE866 EU shield mechanical design slightly differs from UE866 other variants but overall dimensions are the same and there is no impact on assembling and footprint area Pin A1 Dimensions in mm Lead free Alloy Surface finishing Ni Au for all solder pads ...

Страница 57: ...ith a standard lead free SMT process 9 1 Footprint In order to easily rework the UE866 is suggested to consider on the application a 1 5 mm placement inhibit area around the module It is also suggested as common rule for an SMT component to avoid having a mechanical part of the application in direct contact with the module NOTE In the customer application the region under WIRING INHIBIT see figure...

Страница 58: ...ll Rights Reserved 9 2 PCB pad design Non solder mask defined NSMD type is recommended for the solder pads on the PCB 9 3 PCB pad dimensions The recommendation for the PCB pads dimensions are described in the following image dimensions in mm Solder resist openings PCB Copper Pad Solder Mask SMD Solder Mask Defined NSMD Non Solder Mask Defined ...

Страница 59: ... pad surfaces Finish Layer Thickness um Properties Electro less Ni Immersion Au 3 7 0 05 0 15 good solder ability protection high shear force values The PCB must be able to resist the higher temperatures which are occurring at the lead free process This issue should be discussed with the PCB supplier Generally the wettability of tin lead solder paste on the described surface plating is better comp...

Страница 60: ...Reserved 9 4 Stencil Stencil s apertures layout can be the same of the recommended footprint 1 1 we suggest a thickness of stencil foil 120 µm 9 5 Solder paste Item Lead Free Solder Paste Sn Ag Cu We recommend using only no clean solder paste in order to avoid the cleaning of the modules after assembly 9 6 Solder reflow Recommended solder reflow profile ...

Страница 61: ...ure Max Tsmax Time min to max ts 150 C 200 C 60 180 seconds Tsmax to TL Ramp up Rate 3 C second max Time maintained above Temperature TL Time tL 217 C 60 150 seconds Peak Temperature Tp 245 0 5 C Time within 5 C of actual Peak Temperature tp 10 30 seconds Ramp down Rate 6 C second max Time 25 C to Peak Temperature 8 minutes max NOTE All temperatures refer to topside of the package measured on the ...

Страница 62: ...0 62 of 70 Reproduction forbidden without Telit Communications PLC written authorization All Rights Reserved 10 PACKAGING 10 1 Tray The UE866 modules are packaged on trays of 70 pieces each These trays can be used in SMT processes for pick place handling ...

Страница 64: ...oreover the customer has to take care of the following conditions a Calculated shelf life in sealed bag 12 months at 40 C and 90 relative humidity RH b Environmental condition during the production 30 C 60 RH according to IPC JEDEC J STD 033A paragraph 5 c The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b IPC JEDEC J STD 033A paragraph 5...

Страница 65: ...e to be taken for the SIM checking carefully the instruction for its use Do not insert or remove the SIM when the product is in power saving mode The system integrator is responsible of the functioning of the final product therefore care has to be taken to the external components of the module as well as of any project or installation issue because the risk of disturbing the GSM network or externa...

Страница 66: ...is device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Le présent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autorisée aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l ap...

Страница 67: ...ncy energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to ...

Страница 68: ... clearly visible at all times when installed in the host device otherwise the host device must be labelled to display the FCC ID and IC of the module preceded by the words Contains transmitter module or the word Contains or similar wording expressing the same meaning as follows Contains FCC ID RI7UE866N3 Contains IC 5131A UE866N3 L appareil hôte doit être étiqueté comme il faut pour permettre l id...

Страница 69: ... 09 Updated Chapter 2 3 8 5 4 2015 01 08 Updated Document Template Packaging Flowcharts 5 2015 01 13 Added Safety Recommendations Added FCC IC Regulatory notices Updated Chapter 2 6 2015 03 30 Updated chapters 4 2 4 4 4 5 5 2 5 8 12 Added RX Sensitivity Added Third Party Rights 7 2015 04 17 Updated Chapter 12 8 2015 06 29 Updated Chapter 8 1 9 2015 07 17 Updated Chapter 12 10 2016 07 27 Added UE86...

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