Telit Wireless Solutions SE868SY-D, Руководство по конструкции аппаратуры, Страница: 33 / 44

SE868SY-D Hardware Design Guide
1VV0301705 Rev. 5 Page 33 of 44 2021-12-15
Not Subject to NDA
Profile Feature Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
) 3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp) 245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.
Table 26: Solder Reflow Profile Specifications
Note: All temperatures refer to topside of the package, as measured
on the package body surface.
Warning: The SE868SY-D module withstands one reflow process
only.